Hewlett-packard Company

Conrad L Wright

C S Chan

Alfred I Pan

Gary E Hanson

Robert R Hay

Frank Ura

James G Bearrs

An ink delivery system for an inkjet printer includes a vented supply chamber for providing a reservoir of ink and an ink compartment which is connected to the supply chamber via a hydrophobic membrane which acts as a fluid diode for regulating the flow of ink from the supply chamber into the compartment.

Ink delivery system for printers

A hybrid type thermal ink jet (TIJ) pen and method of manufacture wherein a plurality of individual thin film ink jet printheads, each including an orifice plate, are selectively spaced on and secured to an insulating substrate having ink feed ports therein which supply ink to the printheads. Buss lines and integrated circuit driver-decoder packages may be mounted in a planar fashion with respect to the printheads and electrically interconnected to drive the printheads. Alternatively, the individual printheads may be mounted on a unitary insulating support and ink feed structure such as a ceramic substrate and interconnected to off-substrate TIJ driver circuitry by way of printed or silk-screened electrical leads. These leads may be laid down in a controlled pattern on the surface of the ceramic substrate and used to interconnect bonding pads on the TIJ printheads with the above off-substrate driver circuitry and power supplies. If desired, integrated circuit packages may be mounted in slots cut in the ceramic substrate in a planar arrangement with respect to the printheads.

Large expandable array thermal ink jet pen and method of manufacturing

A passivation layer in a thermal ink jet printhead is formed or 'grown' by a reaction between the materials of the ink jet structure to be protected and an element which will form a chemically inert, electrically insulating, thermally conductive compound. The resistor structure may be of tantalum or tantalum nitride and the electrical conductors therefor may be of aluminum. By subjecting this resistor-conductor structure to a reactive oxide atmosphere, the exposed surfaces of both are anodized so that a surface film of aluminum oxide is formed on the aluminum conductor and a surface film of tantalum pentoxide or tantalum oxynitride is formed on the resistor structure.

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Boise, ID, United States of America

Conrad L Wright