Hewlett-packard Development Company, L.P.

Conrad Jenssen

Shen Buswell

Paul Templin

Michael W Cumbie

Rio Rivas

Mark H MacKenzie

Anthony M Fuller

Daren L Forrest

Michael Groom

Mahrgan Khavarl

Mark H MacKenzle

A device includes a plurality of fluid ejection dies, wherein each of the fluid ejection dies includes a contact pad and a plurality of fluid actuation devices. The device includes an electrical interconnect element in contact with the contact pad of each of the fluid ejection dies to electrically interconnect the plurality of fluid ejection dies.

Fluid ejection devices including electrical interconnect elements for fluid ejection dies

A method of fabricating a fluid feed slot in a print head substrate includes making a cut into a first surface of a substrate using a cutting disk having a generally planar surface oriented generally perpendicular to the first surface, and removing material from a second surface of the substrate. Making the cut and removing the material form, in combination, the fluid feed slot in the substrate at least a portion of which passes entirely through the substrate, with a full length of the fluid feed slot extending less than a full length of the substrate, and making the cut into the first surface includes providing a first completed portion of the fluid feed slot with curved surfaces at opposite end walls thereof converging from the first surface toward the second surface.

Methods and systems for forming slots in a semiconductor substrate

The exemplary embodiments describe a semiconductor substrate having microelectronics integrated thereon. In one exemplary embodiment, the semiconductor substrate comprises a plurality of fluid ejecting elements positioned over a substrate. The semiconductor substrate can further comprise one or more fluid feed channel(s) formed in the substrate. The one or more fluid feed channel(s) being configured to deliver fluid to the plurality of fluid ejecting elements. The one or more fluid feed channel(s) are defined at least in part by first and second substantially parallel side walls and first and second non-parallel end walls.

Slotted semiconductor substrate having microelectronics integrated thereon

Growing community of inventors

Corvallis, OR, United States of America

Conrad Jenssen