Chemcut Corporation

Other

Conrad D Shakley

Daniel L Goffredo

Joseph M Brady

Walter J Meyer

James J Ash

Franz R Cordes

Klaus H Gedrat

Guide elements are provided to be mounted on rotatable drive rods of a conveyor apparatus, preferably of the type for wet processing of thin electrical printed circuit boards or printed circuit film, as the same is subjected to acid, neutralizer, water, air, sprays, rinses or the like, as such thin materials are moved through the machine. The guides serve to keep the thin materials from falling out of their intended planar path of travel through the machine, but are readily removable, preferably in snap-on, snap-off fashion for ready conversion of the apparatus to handle thicker materials in which such guide elements are not needed. The guide elements may be mounted in staggered fashion across the apparatus and serially along the path of travel through the apparatus. The elements are configured to resist twisting and allow rotatable drive rods to continue to rotate while the elements are disposed on the drive rods, but without rotation of the guide elements.

Product guide for processing equipment

An electroplating apparatus and method is provided, whereby generally flat workpieces, such as metal plates and the like may be electroplated, on a continuous basis, automatically and without manual intervention. The workpieces are delivered horizontally through a bath of electrolyte. They are conveyed through the bath by being engaged by driven contact wheels that also serve as one of the electrodes. The other electrode is in the bath electrolyte solution. As the workpieces are delivered through the bath, they are engaged and disengaged by the contact wheels, but are always in engagement with contact wheels for not only continuous conveyance, but for continuous electrical connection therewith. A particular slide mount is provided for holding an opposite side of the plate as the plate is carried along its flow path, and this mount is adjustably positionable to accommodate different width workpieces. Solution flow through the electrolyte path is provided on a continuous basis, and both agitates and replenishes the electrolyte solution. Dams are created at ends of the flow path, by the action of squeezing rollers, to prevent passage of electrolyte. Wipers are provided for preventing the turbulence of newly-delivered electrolyte in the bath zone from immediately contacting the contact wheels. Other features are also provided.

Electroplating apparatus and method

Printed circuit boards are carried generally vertically, along a path, with the tabs at the lower end being immersed in an electrolyte. The boards are automatically conveyed through opposed serially arranged pairs of rollers, which drive them along their path. Brushes wipe the boards to prevent contact with electrolyte above the desired contact level, as they are conveyed along the path. The solution is constantly replenished and turbulence provided by delivering electrolyte solution, with insoluble metallic ions in it, by pumping the solution from a sump, through an array of nozzles along each side of the path, thus providing fresh electrolyte along with providing turbulence to the electrolyte. The nozzles are charged at a sufficiently low level to avoid their destruction. Electrical contact is made with the printed circuit boards, by means of serially engaging the boards with spring fingers of a continuous conductor along each side of the boards as they are conveyed along their path, and thereby conducting the applied charge to the immersed tabs, whereby the tabs function as cathodes for electrodeposition of metallic ions thereon. The drive for the boards is provided by means of opposed pairs of rollers. One roller in each pair is a driving roller, with the opposing roller functioning as an idler, but forming an interference fit between the rollers as the boards are carried therebetween.

Apparatus and method of treating tabs of printed circuit boards and the

An electroplating apparatus and method is provided, whereby generally flat workpieces, such as metal plates and the like may be electroplated, on a continuous basis, automatically and without manual intervention. The workpieces are delivered horizontally through a bath of electrolyte. They are conveyed through the bath by being engaged by driven contact wheels that also serve as one of the electrodes. The other electrode is in the bath electrolyte solution. As the workpieces are delivered through the bath, they are engaged and disengaged by the contact wheels, but are always in engagement with contact wheels for not only continuous conveyance, but for continuous electrical connection therewith. A particular slide mount is provided for holding an opposite side of the plate as the plate is carried along its flow path, and this mount is adjustably positionable to accommodate different width workpieces. Solution flow through the electrolyte bath is provided on a continuous basis, and both agitates and replenishes the electrolyte solution. Dams are created at ends of the flow path, by the action of squeezing rollers, to prevent passage of electrolyte. Wipers are provided for preventing the turbulence of newly-delivered electrolyte in the bath zone from immediately contacting the contact wheels. Other features are also provided.

Modular chemical treatment apparatus with improved sidewall connecting and alignment means consisting of a connecting member secured to abutting sidewalls, the connecting member overlying and held in intimate contact with a longitudinal, vertical planar surfce. A variety of such connecting and alignment means are disclosed.

Connecting and alignment means for modular chemical treatment system

An etching system is disclosed, whereby individual and discrete modules are provided, each for performing its own function, with the modules being longitudinally connected in serial arrangement, and being aligned by suitable pin-in-hole arrangement, and with a common drive for all of the modules, by the use of drive rods carried by each of the modules that are coupled together with the connecton of adjacent modules. Individual features of the various drive means are also disclosed.

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Spring Mills, PA, United States of America

Conrad D Shakley