Stmicroelectronics (malta) Ltd

Stmicroelectronics S.r.l.

Stmicroelectronics Ltd (malta)

Stmicroelectrics S.r.l.

Conrad Cachia

David Oscar Vella

Damian Agius

Maria Spiteri

Federico Giovanni Ziglioli

Mark Andrew Shaw

Giovanni Graziosi

Mario Francesco Cortese

Mark Anthony Azzopardi

Kenneth Fonk

Stefano Pozzi

A MEMS device package comprising a first die of semiconductor material including a contact pad and a second die of semiconductor material stacked on the first die. The second die is smaller than the first die. The second die includes a contact pad, and a conductive wire is coupled between the contact pad of the first die and a contact pad of the second die. A mold compound is on the second die and the first die. A vertical connection structure is on the contact pad of the second die. The vertical connection structure extends through the mold compound.

Wafer level package for a mems sensor device and corresponding manufacturing process

A MEMS device having a wafer-level package, is provided with: a stack of a first die and a second die, defining at least a first internal surface internal to the package and carrying at least an electrical contact pad, and at least a first external surface external to the package and defining a first outer face of the package; and a mold compound, at least in part coating the stack of the first and second dies and having a front surface defining at least part of a second outer face of the package, opposite to the first outer face. The MEMS device is further provided with: at least a vertical connection structure extending from the contact pad at the first internal surface towards the front surface of the mold compound; and at least an external connection element, electrically coupled to the vertical connection structure and exposed to the outside of the package, at the second outer face thereof.

Wafer level package for a MEMS sensor device and corresponding manufacturing process

One or more embodiments of the present disclosure are directed to packages that include a stacked microelectromechanical sensor MEMS die and an application-specific integrated circuit (ASIC) die. The smaller of the MEMS die and the ASIC die is stacked on the larger of the MEMS die and the ASIC die. The larger of the two dice may form one or more dimensions of the package. In one embodiment, a bottom surface of the larger of the two dice forms an outer surface of the package. In that regard, the package may take less lateral space on another component, such as a board or other package.

Packages for semiconductor devices and methods for assembling same

A method of stacking a plurality of first dies to a respective plurality of second dies, each one of the first dies having a surface including a surface coupling region which is substantially flat, each one of the second dies having a respective surface including a respective surface coupling region which is substantially flat, the method comprising the steps of: forming, by means of a screen printing technique, an adhesive layer on the first dies at the respective surface coupling regions; and arranging the surface coupling region of each second die in direct physical contact with a respective adhesive layer of a respective first die among said plurality of first dies.

Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device

A method for testing a strip of MEMS devices, the MEMS devices including at least a respective die of semiconductor material coupled to an internal surface of a common substrate and covered by a protection material; the method envisages: detecting electrical values generated by the MEMS devices in response to at least a testing stimulus; and, before the step of detecting, at least partially separating contiguous MEMS devices in the strip. The step of separating includes defining a separation trench between the contiguous MEMS devices, the separation trench extending through the whole thickness of the protection material and through a surface portion of the substrate, starting from the internal surface of the substrate.

Method for strip testing of MEMS devices, testing strip of MEMS devices and MEMS device thereof

A semiconductor package substrate suitable for supporting a damage-sensitive device and a package substrate core having an upper and a lower surface. At least one pair of metal layers coats the upper and lower surfaces of the package substrate core. One pair of solder mask layers coats the outer metal layers of the at least one pair of metal layers. A plurality of vias is formed across the package substrate core and the at least one pair of metal layers. Advantageously, the plurality of vias is substantially distributed according to a homogeneous pattern in an area that is to be covered by the damage-sensitive device. A method for the production of such semiconductor package substrate is also described.

Growing community of inventors

Tarxien, Malta

Conrad Cachia