Mattson Technology, Inc

Fortrend Engineering Corporation

Conor Patrick O'Carroll

Paul Janis Timans

Zion Koren

James Tsuneo Taoka

Rudy Santo Tomas Cardema

Shuen Chun Choy

Arieh A Strod

Arnon Gat

Daniel J Devine

Yao Zhi Hu

Zsolt Nenyei

Wilfried Lerch

John M Rush

Sing-Pin Tay

Bob Bogart

Patrick Schmid

J Randolph Andrews

Manfred Falter

Chris Bragg

Jüergen Niess

David Ou

Richard Collins

Rudy Cardema

Igor Fidelman

Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device for heating the wafers. The wafers are placed in the thermal processing chamber in a face-to-face configuration or in a back-to-back configuration.

Method and system for thermally processing a plurality of wafer-shaped objects

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.

Heating configuration for use in thermal processing chambers

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. The light energy sources can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be either active sources of light energy or passive sources which reflect, refract or absorb light energy. For instance, in one embodiment, the tuning devices can comprise a lamp spaced from a focusing lens designed to focus determined amounts of light energy onto a particular location of a wafer being heated.

Heating device for heating semiconductor wafers in thermal processing chambers

An apparatus for heat treating semiconductor wafers in a thermal processing chamber using light energy is provided. In one embodiment, the apparatus contains a window located between the semiconductor wafer and the energy source. The window contains a member that defines at least one passage capable of being placed into communication with a coolant to cool the window and at least partially offset the &ldquo;first wafer effect&rdquo;. Additionally, in some embodiments, the window has a thickness greater than about 1 inch so that it can withstand pressures applied during wafer processing.

Windows used in thermal processing chambers

A wafer sorting system utilizing optical character recognition and optical 'gate sensors' to determine the orientation of the wafers for prealigning. It is envisioned that the machine will be installed in conjunction with a computer controller and multiple cassette stations. A first end of a transfer arm of a robot is equipped with an end effector to transfer individual wafers. The end effector of the transfer arm is extendable and retractable to select and remove the desired wafer from its cassette, and to transfer it to the prealigner or a target cassette in its proper orientation. The end effector includes a vacuum pickup and a sensor that enables detection of presence or absence of wafers in the cassette, and any misaligned wafers in the cassette. Further gate sensors are mounted on the prealigner to accomplish the orientation function prior to the wafer being placed on the prealigner chuck. Multiple perimeter points are used to determine the position of the center of the wafer. The optical character recognition capability of the system then allows the individual wafers to be identified and to be sorted as desired.

Method and apparatus for prealigning wafers in a wafer sorting system

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Sunnyvale, CA, United States of America

Conor Patrick O'Carroll