International Business Machines Corporation

Connie Jean Mathison

Phillip Duane Isaacs

Miles Frank Swain

Mark Kenneth Hoffmeyer

Gregg A Knotts

Michael J Lorsung

A electronic apparatus and a process for its manufacture are disclosed. The apparatus includes a planar card for accommodating an electronics module package having protruding solder columns and solder joints to mechanically mount and electrically connect the solder columns of the module to the planar card. The planar card includes a first side and a second side, a plurality of wiring lines forming a wiring pattern, and a plurality of vias extending at least partially through the card. Each of the vias includes at least one recessed area extending from one or both sides of the card. The recessed areas extending to a depth within the planar card sufficient to wick the solder joints, and the each of the recessed areas are shaped to provide surface tension to mechanically retain the solder joints.

Column grid array or ball grid array pad on via

A direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization are provided. After at least one integrated circuit chip is attached to a carrier, an aqueous cleaning solution containing citric and oxalic acid based additives is applied to the carrier and attached integrated circuit chip. Then a deionized water rinse is applied to the carrier and attached integrated circuit chip, followed drying for a set time period. Next wirebonding on copper circuitization carried by the carrier is performed.

Direct chip attachment process and apparatus for aluminum wirebonding on

The invention relates to a method of making a local structure from an organic mandrel on a substrate at the submicrometer level. The mandrel is formed from an organic layer deposited on the substrate. The mandrel is then removed by exposure to an oxygen plasma environment, thus leaving a cavity. A local structure material is deposited into the cavity and polished to form the local structure. In the preferred method of the invention, an electrically conducting, local interconnect is formed from a polyimide mandrel on a wafer used to make integrated circuits.

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Pine Island, MN, United States of America

Connie Jean Mathison