Sien (qingdao) Integrated Circuits Co., Ltd

Conghui Liu

Min-Hwa Chi

Huan Wang

Longkang Yang

Peng Li

Richard Ru-Gin Chang

Dongyang Zhou

Jinpeng Qiu

Ching-Ju Lin

Ying-Tsung Wu

The present invention provides a device having a trench gate structure and a method of making the same. The device comprises a substrate, a drift region, a well region, a trench gate, a heavily-doped region, and an electrode positioned on the heavily-doped region. The structure of the device is simple to provide good VDMOS and IGBT breakdown voltages, and meanwhile take on-state resistance and reliability of oxide into account.

Notch shape of trench gate bottom corner for better breakdown voltage of power MOSFET and IGBT with good trade off to ron and ox reliability

The present invention provides a power device with super junction structure (or referred to as super junction power device). When making a super junction power device, impurity of a second conductive type may be implanted into an epitaxial layer of a first conductive type to form a floating island of the second conductive type and a pillar of the second conductive type successively through a super junction mask (or reticle) after forming the epitaxial layer of the first conductive type, directly through a well mask (or reticle) before or after forming a well of the second conductive type, and directly through a contact mask (or reticle) before or after forming a contact structure. Multiple epitaxial processes and deep trench etching process may not be needed. Therefore, the process is simple, the cost is low and yield and reliability are high. Because the super junction power device of the present invention has both the floating island of the second conductive type and the pillar of the second conductive type, in open state, a breakdown voltage may be raised and both Miller capacitance and input capacitance can be decreased and in on state, an on-state resistance can be decreased.

Super junction power device

The present invention provides a power device with super junction structure (or referred to as super junction power device) and a method of making the same. When making a super junction power device, impurity of a second conductive type may be implanted into an epitaxial layer of a first conductive type to form a floating island of the second conductive type and a pillar of the second conductive type successively through a super junction mask (or reticle) after forming the epitaxial layer of the first conductive type, directly through a well mask (or reticle) before or after forming a well region of the second conductive type, and directly through a contact mask (or reticle) before or after forming a contact structure. Multiple epitaxial processes and deep trench etching process may not be needed. Therefore, the process is simple, the cost is low and yield and reliability are high. Because the super junction power device of the present invention has both the floating island of the second conductive type and the pillar of the second conductive type, in open state, a breakdown voltage may be raised and both Miller capacitance and input capacitance can be decreased and in on state, an on-state resistance can be decreased.

Super junction power device and method of making the same

The present invention provides a power device with super junction structure (or referred to as super junction power device) and a method of making the same. A floating island of a second conductivity type of a cell region, a floating island of the second conductivity type of a termination region, a pillar of the second conductivity type of the cell region and a pillar of the second conductivity type of the termination region may be formed through adding a super junction mask (or reticle) after forming the epitaxial layer of a first conductivity type, through a well mask (or reticle) before or after forming a well of the second conductivity type, and through a contact mask (or reticle) before or after forming a contact structure. Therefore, the process is simple, the cost is low and yield and reliability are high. A breakdown voltage (or referred to as withstand or blocking voltage) may be raised as a result of the charge sharing effect of the floating island of the second conductivity type and the pillar of the second conductivity type in the cell region and both Miller capacitance and input capacitance can be decreased. An on-state resistance can be decreased due to a higher doping level of the epitaxial layer of a first conductivity type allowed to use without degrading the breakdown voltage. A withstand (or blocking) voltage in the termination region may be raised, an area thereof may be reduced, and a whole area of a high voltage device may be decreased because of the floating island of the second conductivity type and the pillar of the second conductivity type of the termination region.

The invention provides a multi-Vt vertical power device and a method of making the same. Through patterning a contact mask, a contact structure array having a shared trench gate structure may be formed, and different traversal gaps between an edge of a contact portion of a second conductivity type and an edge of a trench may be formed in the contact structure array. As such, multi-Vt vertical states may be implemented for storing information. The present invention allows making a multi-Vt vertical power device having different Vt's to be capable to store information without additional process steps. Therefore, with respect to the present invention, the process is simple, cost is low, and application field is wide; number of Vt varies to store multi-bit digital information or analog information in the power device; the built-in multi-Vt power MOSFET and IGBT are adapted not only for the high power applications but also for information storage.

Structure and method of new power MOS and IGBT with built-in multiple VT'S

The present invention provides a power device with super junction structure (or referred to as super junction power device) and a method of making the same. When making a super junction power device, impurity of a second conductive type may be implanted into an epitaxial layer of a first conductive type to form a floating island of the second conductive type and a pillar of the second conductive type successively through a super junction mask (or reticle) after forming the epitaxial layer of the first conductive type, directly through a well mask (or reticle) before or after forming a well of the second conductive type, and directly through a contact mask (or reticle) before or after forming a contact structure. Multiple epitaxial processes and deep trench etching process may not be needed. Therefore, the process is simple, the cost is low and yield and reliability are high. Because the super junction power device of the present invention has both the floating island of the second conductive type and the pillar of the second conductive type, in open state, a breakdown voltage may be raised and both Miller capacitance and input capacitance can be decreased and in on state, an on-state resistance can be decreased.

The present application provides an insulated gate bipolar transistor (IGBT) device with narrow mesa and a manufacture thereof. The device comprises: a semiconductor substrate; gate trench structures and emitter trench structures formed on front surface of the semiconductor substrate and alternately arranged along with horizontal direction; wherein the gate trench structures and the emitter trench structures are respectively set in pair along with the arrangement direction, and the pairs of the gate trench structures and the pairs of the emitter trench structures are set in alternate arrangement along with the arrangement direction; well regions formed between the emitter trench structures of one pair; emitter injection regions formed between the gate trench structures of one pair and between the emitter trench structures of one pair, respectively; and wherein, in the region between the emitter trench structures of the one pair, the emitter injection region is above the well region.

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Qingdao, China

Conghui Liu