Intel Corporation

Columbia Mishra

James G Hermerding, Ii

Mark Charles Carbone

Juha Paavola

Carin Ruiz

Bijendra Singh

Soethiha Soe

Justin Michael Huttula

Navneet Kumar Singh

Helin Cao

Jeff Ku

Prakash Kurma Raju

Chee Lim Nge

Jianfang Olena Zhu

Vivek Paranjape

Prasanna Pichumani

Daniel J Ragland

Bo Qiu

Gavin Sung

Srikanth Potluri

Gustavo Fricke

Arnab Sen

Deepak Samuel Kirubakaran

Hua Yang

Mark J Gallina

Mikko Antero Makinen

Kannan G Raja

Lance Lin

Gokul V Subramaniam

Baomin Liu

Jason Y Jiang

Kathiravan D

Xiyong Tian

Akhilesh P Rallabandi

Twan Sing Loo

Ruander Cardenas

Jia Yan Go

Hari Shanker Thakur

Christopher M Moore

Evan Piotr Kuklinski

Gerry Juan

Ritu Bawa

Renji Thomas

Javed Shaikh

Chin Kung Goh

George Baoci Sun

Shih Wei Nien

Chun-Ting Liu

Arijit Chattopadhyay

Mikko Makinen

Nehakausar Pinjari

Sammi Wy Liu

Khal Ern See

James Hermerding Ii

Navneet Singh

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices

Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.

Heat pipe for improved thermal performance at cold plate interface

Methods, apparatus, and systems to dynamically schedule a workload to among compute blocks based on temperature are disclosed. An apparatus to schedule a workload to at least one of a plurality of compute blocks based on temperature includes a prediction engine to determine (i) a first predicted temperature of a first compute block of the plurality of compute blocks and (ii) a second predicted temperature of a second compute block of the plurality of compute blocks. The apparatus also includes a selector to select between the first compute block and the second compute block for assignment of the workload. The selection is based on which of the first and second predicted temperatures is lower. The apparatus further includes a workload scheduler to assign the workload to the selected one of the first or second compute blocks.

Methods, apparatus, and systems to dynamically schedule workloads among compute resources based on temperature

Apparatus and methods for thermal management of electronic user devices are disclosed herein. An example apparatus includes at least one of a user presence detection analyzer to identify a presence of a user relative to an electronic device based on first sensor data generated by a first sensor or at least one of an image data analyzer or a motion data analyzer to determine a gesture of the user relative to the device based on second sensor data generated by a second sensor; a thermal constraint selector to select a thermal constraint for a temperature of an exterior surface of the electronic device based on one or more of the presence of the user or the gesture; and a power source manager to adjust a power level for a processor of the electronic device based on the thermal constraint.

Apparatus and methods for thermal management of electronic user devices based on user activity

Apparatus and methods for thermal management of electronic user devices are disclosed herein. An example electronic device disclosed herein includes a housing, a fan, a first sensor, a second sensor, and a processor to at least one of analyze first sensor data generated by the first sensor to detect a presence of a subject proximate to the electronic device or analyze second sensor data generated by the second sensor to detect a gesture of the subject, and adjust one or more of an acoustic noise level generated the fan or a temperature of an exterior surface of the housing based on one or more of the presence of the subject or the gesture.

Particular embodiments described herein provide for an electronic device that can be configured to include a torsional heat pipe. The torsional heat pipe can include a first housing static portion located in a first housing of an electronic device, where the first housing static portion is coupled to a heat source, a second housing static portion located in a second housing of the electronic device, where the second housing static portion is coupled to a heat spreader, and a torsion portion located in a hinge of the electronic device, where the hinge rotatably couples the first housing to the second housing and the torsion portion rotates as the second housing rotates relative to the first housing and the torsion portion couples the first housing static portion to the second housing static portion.

Torsional heat pipe

Growing community of inventors

Hillsboro, OR, United States of America

Columbia Mishra