Entegris, Inc.

Colton J Harr

Matthew A Fuller

Kobold Yang

Wei Sheng Hsu

Ian Dutro

A substrate container includes a shell defining an interior space and a manifold with an inlet and a gas distributing surface. The shell includes a front opening, a bottom wall, and a rear wall. The manifold is attached to the bottom wall and is closer to the front opening than the rear wall. The gas distributing surface is configured to distribute purge gas into the interior space. A method of purging an open substrate container includes supplying a first stream of purge gas to a manifold and supplying a second stream of purge gas to an interior space of the substrate container. The method also including the manifold distributing the purge gas of the first stream within the interior space of the substrate container.

Manifold for a substrate container

A purge port assembly for a wafer container includes a purge module configured to allow inlet flow of purge gas and a transition portion disposed over an intermediate outlet of the purge module. The transition portion includes a receiver configured to receive the purge gas discharged from the purge module, an outlet connector configured to attach with a diffuser, and an intermediate conduit. The intermediate conduit connects the receiver to the outlet connector and extends from the receiver at an acute angle relative to an axis of the inlet opening of the receiver. The intermediate conduit has a length that spaces apart the outlet connector from the receiver. A wafer container includes a shell and a purge port assembly. The shell includes an interior space. The purge port assembly extends through an opening in the shell into the interior space.

Wafer container purge port assembly

Wafer cushions for use in wafer carriers include spring beams that include a first arm extending from the frame of the wafer cushion in a first direction and a second arm extending from the first arm in a second direction, and a wafer contact at the end of the second arm opposite where the second arm is joined to the first arm. The wafer cushion may contact a substrate within the wafer carrier only at the wafer contacts during normal conditions. The substrate may also contact secondary contact points on the second arm when a shock event occurs. The wafer contact can be v-groove style wafer contact. The wafer contact may include a contact surface having a convex surface where it is configured to contact the wafer.

Wafer cushion

A substrate retainer () is provided which presents a substantially uniform contact face () that can accommodate a large variation in the location of substrate registration thereon. The uniform contact face () is allowed to deflect and compress in order to eliminates the prospect of substrates () being damaged by or becoming inadvertently pinched within the substrate retainer () or from being pressed too hard by the uniform contact face (). With this arrangement, no adhesives or tapes are utilized, so there is no attendant out gassing of volatile organic compounds to contaminate the microenvironment, or complications due to incompatibility of such adhesives and tapes with washing processes.

Substrate cushion brace retainer

A substrate support assembly for a substrate container. The assembly may include a pair of substrate support columns each including a stack of a plurality of shelf members and a plurality of support rods inserted through the stack for securing the stack together. Each shelf member may include a blade portion having first and second opposing surfaces and an inner and outer periphery. Each surface of the blade portion may include a rib structure and a plurality of bosses positioned towards the outer periphery and extending from a forward portion to a rearward portion of the blade portion. Interlocking features may be defined on the rib structures. The stack of the shelf members may include each shelf member stacked with one or more adjacent shelf members via the rib structures, thereby interlocking each shelf member with the one or more adjacent shelf members via the interlocking features.

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Colorado Springs, CO, United States of America

Colton J Harr