Gridtential Energy, Inc.

Crown Battery Manufacturing Company

Collin Kwok Leung Mui

Daniel Jason Moomaw

Peter G Borden

Christiaan Willem Beekhuis

Esteban M Hinojosa

Jaime Navarrete

Apparatus and techniques such as can include a sealed bipolar battery assembly are described herein. For example, the battery assembly can using two or more sealing techniques, such as to provide a liquid-tight assembly. A sealed current collector assembly can be provided, such as by fitting compressible plastic seals to one or both side of a current collector. An adhesive seal can be applied to an edge or perimeter of the current collector. A plastic seal assembly can be used to anchor the seals or to provide an additional layer of leakage protection should electrolyte seep under hydrophobic plastic seals. Current collector assemblies including stackable casing frames can be assembled to provide a rigid casing. These casing assemblies can be stacked on top of one another to form bipolar cells comprising the battery assembly.

Sealed bipolar battery assembly

A current collector assembly, such as for a bipolar lead acid battery, can include an electrically-conductive silicon substrate and a frame bonded to the electrically-conductive silicon substrate. The substrate can be treated or modified, such as to include one or more thin films which render a surface substrate electrically conductive and electrochemically stable in the presence of a lead acid electrolyte chemistry. An interface between the frame and the electrically-conductive silicon substrate can be hermetically sealed. In an example, the frame can provide an edge-seal ring configuration. In an example, a casing assembly can include a spacer bonded to the substrate, along with a casing segment and a thermally-conductive rib, the spacer isolating the thermally-conductive rib from the electrically-conductive silicon substrate electrically.

Bipolar battery seal and thermal rib arrangements

Apparatus and techniques are described herein for providing a battery plate assembly including a silicon current collector. The silicon current collector can include apertures. A lead layer or lead alloy layer can be formed on the silicon current collector. A monopolar battery assembly can be provided, such as including monopolar battery plate assemblies comprising silicon current collectors. The silicon can include a conductive metallurgical grade silicon, such as cast and cut to provide individual current collector substrates.

Silicon current collector for lead acid battery

Apparatus and techniques are described herein for providing a plate such as can be included as a portion of a hybrid energy storage device assembly. A hybrid device can include capacitor and battery structures, such as can include a sealed stack of hybrid bipolar plates comprising silicon wafers.

Bipolar hybrid energy storage device

Energy storage device

Apparatus and techniques herein related battery plates. For example, a first battery plate can include a conductive silicon wafer. A first mechanical support can be located on a first side of the conductive silicon wafer. A first active material can be adhered to the first mechanical support and the first side of the conductive silicon wafer, the first active material having a first polarity. In an example, the battery plate can be a bipolar plate, such as having a second mechanical support located on a second side of the conductive silicon wafer opposite the first side, and a second active material adhered to the second mechanical support and the second side of the conductive silicon wafer, the second material having an opposite second polarity.

Rechargeable battery with wafer current collector and assembly method

Apparatus and techniques are described herein for providing a bipolar battery plate such as can be included as a portion of an energy storage device assembly, such as a battery. The bipolar battery plate can include a silicon substrate. A first metal layer can be deposited on a first surface of the rigid silicon substrate, and a different second metal layer can be deposited on a second surface of the rigid silicon substrate opposite the first surface. The first and second metal layers can be annealed to form a first silicide on the first surface and a different second silicide on the second surface of the rigid silicon substrate.

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Mountain View, CA, United States of America

Collin Kwok Leung Mui