Other

Macdermid, Incorporated

Macdermid Acumen, Inc.

Colleen Mckirryher

Steven A Castaldi

Kesheng Feng

Ernest Long

Ming De Wang

Carl P Steinecker

Lenora M Toscano

Donna M Kologe

Donna Kologe

John L Cordani, Jr

Paul Romaine

A composition for providing acid resistance to copper surfaces in the production of multilayered printed circuit boards. The composition comprises an acid, an oxidizer, a five-membered heterocyclic compound and a thiophosphate or a phosphorous sulfide compound. In a preferred embodiment, the phosphorous compound is phosphorus pentasulfide. The composition is applied to a copper or copper alloy substrate and the copper substrate is thereafter bonded to a polymeric material.

Acid-resistance promoting composition

An adhesion promoting composition and a process for treating metal surfaces with the adhesion promoting composition is described. The adhesion promoting composition comprises an oxidizer, an acid, a corrosion inhibitor, a source of halide ions and a material selected from a mercapto propane sulfonate, mercapto propane sulfonic acid, and bis-sodium sulfopropyl disulfide. The adhesion promoting composition increases the adhesion of polymeric materials to the metal surfaces and also provides increased acid resistance.

Process for improving the adhesion of polymeric materials to metal surfaces

A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with a silver plate prior to soldering, which immersion silver plate is treated with an additive comprising a mercapto substituted or thio substituted silane compound. Preferred post treatments comprise 3-mercapto propyl trimethoxysilane and/or 3-oxtanoylthio-1-propyltriethoxy silane.

Method for enhancing the solderability of a surface

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Thomaston, CT, United States of America

Colleen Mckirryher