Teledyne Technologies Incorporated

Colleen L Khalifa

Cuong Van Pham

David E Chubin

Aaron D Kuan

Randall David Buller

A method of fabricating an electronic circuit including forming a first depression on a first surface of a first wafer and forming a second depression on the first surface of the first wafer. The second depression is adjacent the first depression and separated from the first depression by a wall. The method further includes locating an actuator on the wall and attaching a first surface of a second wafer to the first surface of the first wafer to cover the first and second depressions. A first portion of the second wafer and the first depression define a first reservoir to contain a first chemical, and a second portion of the second wafer and the second depression define a second reservoir to contain a second chemical.

Destructor integrated circuit chip, interposer electronic device and methods

A semiconductor device. The device includes a substrate and an integrated circuit chip. The device also includes an electrically or thermally reactive layer located between a top surface of the substrate and a bottom surface of the integrated circuit chip, wherein the reactive layer is positioned such that detection of tampering causes the reactive layer to be electrically or thermally energized such that the semiconductor device is at least partially destroyed.

A semiconductor chip includes a first integrated circuit chip and a depression substrate attached to the integrated circuit chip, wherein the integrated circuit chip and the depression substrate define a cavity therebetween. The semiconductor chip also includes a stress sensitive material located in the cavity and a chemical located in the cavity, wherein detection of tampering causes a reaction by the chemical such that the semiconductor chip is at least partially destroyed.

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Perris, CA, United States of America

Colleen L Khalifa