Monarch Biosciences, Inc.

Neurosigma, Inc.

University of California

Other

The United States Government As Represented by the Department of Veterans Affairs

Nsvascular, Inc

Colin Kealey

Vikas Gupta

Ian A Cook

Leon Ekchian

Christopher M DeGiorgio

Patrick R Miller

Alfred David Johnson

Antonio A F Desalles

Alessandra Gorgulho

Patrick Miller

Christopher M Degiorgio

Antonio AF Desalles

A spiral-based thin-film mesh for medical devices and related methods is provided. The spiral-based thin-film mesh may be used as a stent cover for a stent device. The thin-film mesh may include a plurality of spirals. The spirals allow the thin-film mesh to expand omni-directionally. In one or more embodiments, the spirals may be logarithmic spirals, golden spirals, approximated golden spirals, box Phi spirals, or Fibonacci spirals. The thin-film mesh may be formed from thin-film Nitinol (TFN), and may be fabricated via sputter deposition on a micropatterned wafer.

Spiral-based thin-film mesh systems and related methods

An apparatus includes a thin-film mesh having a plurality of pores that form a region of high pore density flanked by regions of low pore density, where radiopaque markers delineate transition zones between regions. The thin-film mesh has a pore density of between 65 and 1075 pores per mmand a percent metal coverage of between 16 and 66%, and includes two thin-film layers joined at two longitudinal edges by a bonding metal deposited at each longitudinal edge between the two thin-film layers.

Thin-film micromesh covers for medical devices and related methods

Thin-film mesh for medical devices and related methods are provided. The thin-film mesh may include slits to be expanded into pores, and the expanded thin-film mesh may be used as a cover for a stent device. The thin-film mesh has a tube-shape and the slits may be angled with respect to a longitudinal axis of the tube-shape thin-film mesh. The angled slits allow for the thin-film mesh to expand in multiple dimensions, including along the longitudinal axis and along the circumferential direction of the tube-shape thin-film mesh. The slits may be provided in diagonal rows arranged in longitudinal columns. Longitudinal columns of different types of slits may be arranged along the circumferential direction on the tube-shape thin-film mesh to form a zig-zag pattern of slits. The thin-film mesh may be formed from thin-film Nitinol (TFN) and may be fabricated via sputter deposition on a micropatterned wafer.

Thin-film micromesh and related methods

An intrasaccular flow diverter includes a wire structure (e.g., a braided wire or a laser-cut hypotube), a thin-film mesh placed over the wire structure, and crimps fixing the thin-film mesh to the wire structure at each crimp. The wire structure and the thin-film mesh between adjacent crimps are expanded radially to form thin-film covered spheroid structures. When deployed in an aneurysm, the spheroid structures may volumetrically fill the aneurysm sac. An intrasaccular flow diverter with an umbrella structure includes a wire structure with a plurality of crimps along the wire structure, and a thin-film covered umbrella structure at one end of the wire structure. The wire structure between adjacent crimps is expanded radially to form a spheroid structure. When deployed in an aneurysm, the thin-film covered umbrella structure may cover the aneurysm neck.

Intrasaccular thin-film flow diverters and related methods

Systems, methods, and apparatus for delivery systems for endovascular devices are disclosed herein. In one or more embodiments, a delivery system comprises a stent comprising a mesh. Further, the delivery system comprises a shaft comprising an inner lumen. Also, the delivery system comprises a sheath encasing the stent. In one or more embodiments, the stent and a first portion of the sheath is connected to an end of a wire, and a second portion of the sheath is folded back and connected to an end of the shaft. Further, the delivery system comprises the wire traversing within the inner lumen of the shaft such that when the shaft is pulled back relative to the wire, the sheath splits open thereby unsheathing and deploying the stent.

Delivery system for endovascular devices

Thin-film mesh for medical devices, including stent and scaffold devices, and related methods are provided. Micropatterned thin-film mesh, such as thin-film Nitinol (TFN) mesh, may be fabricated via sputter deposition on a micropatterned wafer. The thin-film mesh may include slits to be expanded into pores, and the expanded thin-film mesh used as a cover for a stent device. The stent device may include two stent modules that may be implanted at a bifurcated aneurysm such that one module passes through a medial surface of the other module. The thin-film mesh may include pores with complex, fractal, or fractal-like shapes. The thin-film mesh may be used as a scaffold for a scaffold device. The thin-film scaffold may be placed in a solution including structural protein such as fibrin, seeded with cells, and placed in the body to replace or repair tissue.

Thin-film micromesh medical devices and related methods

A spiral-based thin-film mesh for medical devices and related methods is provided. The spiral-based thin-film mesh may be used as a stent cover for a stent device. The thin-film mesh may include a plurality of spirals. The spirals allow the thin-film mesh to expand omni-directionally. In one or more embodiments, the spirals may be logarithmic spirals, golden spirals, approximated golden spirals, box Phi spirals, or Fibonacci spirals. The thin-film mesh may be formed from thin-film Nitinol (TFN), and may be fabricated via sputter deposition on a micropattemed wafer.

A device includes an elastic tubular stent including struts forming closed cells arranged in rows along a circumferential direction of the stent, with each cell having a first obtuse-angled corner on one end of the cell along a longitudinal direction of the stent and a second obtuse-angled corner on an opposing end of the cell along the longitudinal direction. The stent may be fabricated by cutting an array of quadrilateral cells in a nitinol hypotube to form a stent, with each cell having four corners with approximately equal angles. The stent may then be expanded radially such that each cell has a first obtuse-angled corner on one end of the cell along a longitudinal direction of the stent and a second obtuse-angled corner on an opposing end of the cell along the longitudinal direction, and heat treated to fix the shape of the stent.

Kink-resistant stent devices and related methods

A thin-film covered stent device may include a thin-film mesh and a stent backbone covered by the thin-film mesh, thereby forming a dual-layer stent structure. The thin-film covered stent device may have smaller pores and a high pore density compared to conventional stents. For example, the thin-film covered stent device may have a slit length of between 50 and 250 micrometers and a pore density of between 134 and 227 pores per mm. The thin-film covered stent device facilitates rapid healing of tissue defects such as those encountered during the endovascular treatment of an aneurysm.

Methods and devices are provided for the use of thin-film cuffs on endovascular grafts. A method includes forming a fenestrated thin-film Nitinol sheet, expanding the fenestrated thin-film Nitinol sheet to expand the fenestrations, and attaching the expanded thin-film Nitinol sheet to a longitudinal end of a cover for an endovascular graft to form a cuff for the endovascular graft. The method may further include implanting the endovascular graft into a blood vessel. An endovascular graft may include a cover having a proximal and distal end, a proximal thin-film mesh cuff extending from the proximal end, and a distal thin-film mesh cuff extending form the distal end.

Thin-film cuff for endothelialization of endovascular grafts

A method of manufacturing three-dimensional thin-film nitinol (NiTi) devices includes: depositing multiple layers of nitinol and sacrificial material on a substrate. A three-dimensional thin-film nitinol device may include a first layer of nitinol and a second layer of nitinol bonded to the first layer at an area masked and not covered by the sacrificial material during deposition of the second layer.

Three-dimensional thin-film nitinol devices

Trigeminal nerves are stimulated based upon pulse counting and chronobiology. A cutaneous electrode assembly is applied to the forehead to stimulate the ophthalmic nerves. A method may include determining a number of pulses to be administered to a patient based upon the disorder being treated, and pulsing current through an electrode assembly to stimulate the patient's supraorbital and supratrochlear nerves with the determined number of pulses. Another method may include determining a pulse repetition frequency for pulses to be administered to a patient based upon the disorder being treated, and pulsing current through an electrode assembly to stimulate the patient's supraorbital and supratrochlear nerves at the pulse repetition frequency.

Trigeminal neurostimulation based upon pulse counting and chronobiology

An implantable subcutaneous electrode system is disclosed. The implantable subcutaneous electrode system may include an electrode body with electrical contacts disposed thereon or integrally formed therein. The electrode body also may include an insulation region defined between the electrical contacts and an aperture defined in the electrode body for receiving an anchoring device. A minimally invasive delivery device and methods for delivery of an implantable electrode system is also provided. The methods may include steps of introducing a needle comprising a cannula and a stylet through a patient's skin, removing the stylet while leaving the cannula in place, introducing an electrode applicator through the cannula, the electrode applicator comprising a hollow driver which receives the electrode assembly, and anchoring the electrode assembly to a bone by driving the hollow driver such that a self-tapping screw within the electrode assembly screws into the bone.

Growing community of inventors

Los Angeles, CA, United States of America

Colin Kealey