Belair Networks Inc.

Ericsson Wifi Inc.

Colin H Soul

Stephen G Rayment

Roland A Smith

Eric Johnson

Gilbert Brunette

A communications system includes a multiple-input/multiple-output (MIMO) architecture for high capacity switched mesh networks. The MIMO architecture has a plurality of radio frequency chains. One of the plurality of radio frequency chains is configured to apply a first frequency offset to a base frequency of an output signal to generate a first transmitting frequency; and another of the plurality of radio frequency chains being configured to apply a second frequency offset to the base frequency to generate a second transmitting frequency. The system uses the carrier frequency offset to lock the clock of the master subsystem to the clock of the slave subsystem, thereby enabling bandwidth expansion to be employed on the MIMO data streams.

System and method for frequency offsetting of information communicated in MIMO-based wireless networks

An interconnection structure for interconnecting circuitry on a first conductive layer to circuitry on a second conductive layer is provided. The interconnection structure of the present invention comprises a signal conductor via surrounded by a plurality of ground vias. The plurality of ground vias shield the signal conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. One feature of the present invention is that the plurality of ground vias can be modified, adjusting their diameters and their placement relative to the signal conductor via, in order to affect the overall characteristic impedance of the interconnection structure. This feature is useful when propagating high frequency signals between signal traces on different conductive layers of a printed circuit board. In view of the high frequencies used in today's wireless communication systems, the interconnection structure proposed aids in the practical implementation of radio frequency modules by mitigating the effects of impedance discontinuities ordinarily present at signal trace-to-via transition regions.

Growing community of inventors

Nepean, Canada

Colin H Soul