Digital Equipment Corporation

Compaq Computer Corporation, Inc.

Colin E Brench

Daniel M Snow

William F McCarthy

Christopher Lee Houghton

Samuel Hammond Duncan

Richard E Olson

Richard M Masters

Stephen E Lindquist

Kenneth R Palumbo

Peter B Barron

Michael Freeman

Robert D Hellweg, Jr

Christopher H Williams

Stephen Richard Coe

A method and apparatus are disclosed for attenuating RF noise produced by electronic systems by providing low RF impedance shorting of heat dissipating structures, such as heat sinks, to PCB reference planes. The RF impedance shorting path uses existing package pins with dedicated electrical paths through the package to the bottom surface of the heat sink. Such an arrangement provides very low RF impedance because of the minimal length and resistance of the shorting path, and also provides minimal disruption of the PCB design rules and tolerances by using existing package leads.

Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures

Method and system for controlling radio frequency radiation in

A set of conductive plates are positioned adjacent to and in close proximity with a unidirectional heatsink on a high frequency integrated circuit. The set of plates is generally electrically attached to the same ground potential voltage supply as the integrated circuit and serves to damped unwanted radio frequency electromagnetic radiation normally emitted by heatsinks. The same arrangement of plates can also serve as an external electromagnetic interference shield apparatus for the integrated circuit. The plates may alternatively be comprised of a conductive mesh to allow air flow through the plates.

Apparatus to minimize integrated circuit heatsink E.M.I. radiation

An interface module for an electronic system that permits signals to pass between a high frequency main circuit board area such as used for central processing units, memories, or other relatively high clock rate components and a low frequency circuit area such as used for standard peripheral circuit modules used for disk drives, video interfaces and the like. The interconnect module is positioned near an opening in a sheet metal bulkhead used as an electromagnetic interference (EMI) barrier around the main circuit area. The interface module uses a connector that is surrounded by one or more conductive shields that contain metal fingers on inboard and outboard sides to provide a ground connection between the interface module and the EMI barrier.

Interface that permits data bus signals to pass between high frequency

A cross polarized electromagnetic interference shield apparatus for an electronic device having a Faraday cage made of two sets of planar conductive plates. Each of the two sets of planar conductive plates have parallel aligned elongated apertures which are not aligned in the same direction, and are spaced apart at a predetermined distance. This arrangement provides improved EMI attenuation and improved air flow over prior planar EMI shields, at a lower cost than prior honeycomb shields.

Two part closely coupled cross polarized EMI shield

A Faraday shield minimizes the leakage of electromagnetic interference (EMI) and radio frequency interference (RFI) of a maximum frequency and corresponding wavelength that emanates from electronic components contained within the shield. The top and bottom each contain apertures that are dimensioned to effectively block the escape of EMI and RFI from the shield and to permit the flow of air to dissipate heat without generating acoustic noise. The thickness of the top of the shield is at least one half of the diagonal length across the largest of the apertures located in the top. The length of the longest aperture side is less than one fourth of the wavelength of the maximum frequency of EMI and RFI contained by the shield. Corresponding relationships exist between the apertures located in the shield bottom and its thickness.

Enclosure for electronic modules

Card cage enclosure

Growing community of inventors

Stow, MA, United States of America

Colin E Brench