Aurora Operations, Inc.

Colin Delaney

Amir Hosseini

Pruthvi Jujjavarapu

Parth Panchal

Zhizhong Tang

Stefan Heinemann

James Ferrara

Ashish Bhardwaj

Yongxuan Liang

Allen Earman

Parth Panchai

A Light Detection and Ranging (LIDAR) sensor system for a vehicle includes: a housing defining a cavity, a first mount positioned within the cavity, a second mount positioned within the cavity, and a micro optics assembly. The micro optics assembly includes a first portion provided on the first mount and a second portion provided on the second mount. The first portion includes: a light source to emit a beam, a first optical component to direct the beam, an optical isolator to allow the beam directed by the first optical component to pass through the optical isolator and to prevent light from being reflected back into the light source, and a second optical component to direct the beam after having passed through the optical isolator. The second portion includes an optical chip assembly to receive the beam after having been directed by the second optical component.

LIDAR sensor system including particular optic design

A modular LIDAR system comprising a seed laser configured to output a beam, a modular modulator coupled to receive the beam output the seed laser and modulate the beam to create a modulated beam, a modular amplifier coupled to receive the modulated beam from the modular modulator and generate an amplified beam, and a modular transceiver chip coupled to the modular modulator and the modular amplifier, the transceiver chip configured to emit the beam perpendicularly from a first surface of the transceiver chip through an optical window; and receive a reflected beam from a target through the optical window.

Light detection and ranging (LIDAR) system including a modular assembly

An integrated chip packaging for a LIDAR sensor mounted to a vehicle includes a laser assembly configured to output a beam, an optical amplifier array chip configured to amplify a beam, and a transceiver chip coupled to the laser assembly and the optical amplifier array chip. The transceiver chip may be configured to emit the beam with reference to a first surface of the transceiver chip through an optical window and receive a reflected beam from a target through the optical window. The integrated chip packaging for the LIDAR sensor defines the configuration of optical components for providing a path for the optical signal to travel in and out of the LIDAR sensor and dissipating the heat generated by the optical components for improved performance.

Chip packaging in light detection and ranging (LIDAR) sensor system

Growing community of inventors

Bozeman, MT, United States of America

Colin Delaney