D-wave Systems Inc.

1372934 B.c. Ltd

Colin C Enderud

Trevor Michael Lanting

Mohammad H S Amin

Paul I Bunyk

Richard G Harris

George E G Sterling

Eric G Ladizinsky

Byong Hyop Oh

Loren J Swenson

Jed D Whittaker

Douglas P Stadtler

Shuiyuan Huang

Fabio Altomare

Nicolas C Ladizinsky

Jason J Yao

Edward G Sterpka

Jeremy P Hilton

Mohammad H Amin

Sergey V Uchaykin

Mark H Volkmann

Richard David Neufeld

Peter D Spear

Gregory Dean Peregrym

Alexandr M Tcaciuc

J Craig Petroff

Edmond Ho Yin Kan

Amar B Kamdar

Pedro A De Buen

Gregory Citver

Elena Tolkacheva

Byong H Oh

Achieving orthogonal control of non-orthogonal qubit parameters of a logical qubit allows for increasing the length of a qubit chain thereby increasing the effective connectivity of the qubit chain. A hybrid qubit is formed by communicatively coupling a dedicated second qubit to a first qubit. By tuning a programmable parameter of the second qubit of a hybrid qubit, an effective programmable parameter of the hybrid qubit is adjusted without affecting another effective programmable parameter of the hybrid qubit thereby achieving orthogonal control of otherwise non-orthogonal qubit parameters. The length of the logical qubit may thus be increased by communicatively coupling a plurality of such hybrid qubits together.

System and methods for achieving orthogonal control of non-orthogonal qubit parameters

A circuit can include a galvanic coupling of a coupler to a qubit by a segment of kinetic inductance material. The circuit can include a galvanic kinetic inductance coupler having multiple windings. The circuit can include a partially-galvanic coupler having multiple windings. The partially-galvanic coupler can include a magnetic coupling and a galvanic coupling. The circuit can include an asymmetric partially-galvanic coupler having a galvanic coupling and a first magnetic coupling to one qubit and a second magnetic coupling to a second qubit. The circuit can include a compact kinetic inductance qubit having a qubit body loop comprising a kinetic inductance material. A multilayer integrated circuit including a kinetic inductance layer can form a galvanic kinetic inductance coupling. A multilayer integrated circuit including a kinetic inductance layer can form at least a portion of a compact kinetic inductance qubit body loop.

Kinetic inductance for couplers and compact qubits

Various techniques and apparatus permit fabrication of superconductive circuits. A superconducting integrated circuit comprising a superconducting stud via, a kinetic inductor, and a capacitor may be formed. Forming a superconducting stud via in a superconducting integrated circuit may include masking with a hard mask and masking with a soft mask. Forming a superconducting stud via in a superconducting integrated circuit may include depositing a dielectric etch stop layer. Interlayer misalignment in the fabrication of a superconducting integrated circuit may be measured by an electrical vernier. Interlayer misalignment in the fabrication of a superconducting integrated circuit may be measured by a chain of electrical verniers and a Wheatstone bridge. A superconducting integrated circuit with three or more metal layers may include an enclosed, matched, on-chip transmission line. A metal wiring layer in a superconducting integrated circuit may be encapsulated.

Systems and methods for fabrication of superconducting integrated circuits

Systems and methods for achieving orthogonal control of non-orthogonal qubit parameters

An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.

Method of fabricating an electrical filter for use with superconducting-based computing systems

Increasing the energy scale of a quantum processor improves its performance. Energy scale of a quantum processor may be increased by increasing the coupling strength of communicatively coupled superconducting devices comprised in the quantum processor. Configuring the physical dimensions of communicatively coupled superconducting devices such that an intentional direct coupling is induced between a pair of superconducting devices communicatively coupled by a coupling device may controllably add an additional mutual inductance to the mutual inductance of the pair of superconducting devices. Furthermore, reducing the beta parameter of a coupling device may improve the tunability of the coupling device. The combined effects of improved tunability of the coupling devices and the increased coupling strength between superconducting devices communicatively coupled by respective coupling devices comprised in the quantum processor may thus improve the performance of the quantum processor.

Systems and methods for increasing the energy scale of a quantum processor

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Vancouver, Canada

Colin C Enderud