Globalfoundries Inc.

Colin Bombardier

Ming He

Keith Donegan

Anbu Selvam Km Mahalingam

Somnath Ghosh

Vikrant Kumar Chauhan

Prakash Periasamy

Eswar Ramanathan

Ashwini Chandrashekar

Qanit Takmeel

Jeric Sarad

Embodiments of the disclosure provide a substrate structure for an integrated circuit (IC) structure, including: a first dielectric layer positioned above a semiconductor substrate; a first plurality of trenches extending at least partially into the first dielectric layer from an upper surface of the first dielectric layer; and a first metal formed within the first plurality of trenches, wherein a spatial arrangement of the first plurality of trenches causes coupling of surface plasmons in the first metal to at least one wavelength of an incident light.

Substrate structure with spatial arrangement configured for coupling of surface plasmons to incident light

Interconnect structures and methods of fabricating an interconnect structure. First and second non-mandrel interconnects are formed in an interlayer dielectric layer. The first non-mandrel interconnect and the second non-mandrel interconnect have respective side surfaces that extend in a first direction. The connector interconnect extends in a second direction transverse to the first direction from the side surface of the first non-mandrel interconnect to the side surface of the second non-mandrel interconnect.

Multi-directional self-aligned multiple patterning

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Clifton Park, NY, United States of America

Colin Bombardier