Semiconductor Components Industries, LLC

Colin B Bosch

Prosanto K Mukerji

Ronald E Thomas

Rajesh Srinivasan

Michael John Seddon

James H Knapp

George W Hawkins

Peter J Gillespie

Laura J Norton

A semiconductor component includes a semiconductor chip (,) having first and second surfaces opposite each other, a semiconductor device (,) in the semiconductor chip (,), and a flexible substrate (,) packaging the semiconductor chip (,).

Flexible substrate for packaging a semiconductor component

A method of manufacturing a semiconductor component includes applying an encapsulant (211) to a wafer (210, 430), degassing the encapsulant (211), and separating the wafer (210, 430) into a plurality of semiconductor components. Manufactured in this manner, the encapsulant (211) of the semiconductor component is substantially devoid of air bubbles and voids.

Semiconductor component and method of manufacture

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Phoenix, AZ, United States of America

Colin B Bosch