Nxp B.v.

Sciosense B.v.

Coen Tak

Marc Andre De Samber

Willem Frederik Adrianus Besling

Remco Henricus Wilhelmus Pijnenburg

Olaf Wunnicke

Casper Van Der Avoort

Romano Hoofman

A die attachment to a support is disclosed. In an embodiment, a semiconductor package includes a support and a die attached to the support by an adhesive on a backside of the die, wherein the die includes a capacitive pressure sensor integrated on a CMOS read-out circuit, and wherein the adhesive covers only a part of the backside of the die.

Attachment of stress sensitive integrated circuit dies

Consistent with an example embodiment, there is an apparatus comprising a carrier, a laminated battery provided on a major surface of the carrier, and an integrated circuit. The laminated battery includes a bottom electrode layer, an electrolyte layer, and a top electrode layer. The integrated circuit is connected to the bottom electrode layer and the top electrode layer. The integrated circuit is surrounded by the laminated battery on the major surface of the carrier.

Integrated battery and IC

Growing community of inventors

Waalre, Netherlands

Coen Tak