Koninklijke Philips Corporation N.v.

Asml Netherlands B.v.

Siemens Healthineers Nederland B.v.

Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno

Philips Lighting Holding B.v.

Lumileds Holding B.v.

Oledworks Gmbh

Koninklijke Philips Electronics N.v.

Coen Adrianus Verschuren

Erwin Paul Smakman

Herbert Lifka

Albert Hendrik Jan Immink

Rifat Ata Mustafa Hikmet

Alexander Marc Van Der Lee

Johannes Joseph Hubertina Barbara Schleipen

Dominique Maria Bruls

Alexey Olegovich Polyakov

Thea Van Der Wijk

Ties Van Bommel

Johannes Catharinus Hubertus Mulkens

Vadim Yevgenyevich Banine

Marcellinus Petrus Carolus Michael Krijn

Pieter Willem Herman De Jager

Christian Kleijnen

Hendrik Johannes Boudewijn Jagt

Jozef Petrus Henricus Benschop

Marinus Aart Van Den Brink

Richard Quintanilha

Ferry Zijp

Margaretha Maria De Kok

Tamara Druzhinina

Bernardo Kastrup

Femke Karina De Theije

Hugo Johan Cornelissen

Nitesh Pandey

Scott Anderson Middlebrooks

Olexandr Valentynovych Vdovin

Teunis Willem Tukker

Hans Willem Van Kesteren

Maxim Pisarenco

Yang-Shan Huang

Jeroen Jan Lambertus Horikx

Erwin John Van Zwet

Durandus Kornelius Dijken

Heidrun Steinhauser

Antonius Maria Bernardus Van Mol

Cristina Tanase

Bart Van Rompaey

Zili Zhou

Peter Van De Weijer

Tiemen Poorter

Paulus Wilhelmus Maria Blom

Margreet De Kok

Wouter Frans Willem Mulckhuyse

Albert H J Immink

Robert Albertus Johannes Van Der Werf

Femke Karina De Theije E/v Wijgergangs

Margaretha M Kok

Olexandr Velentynovych Vdovin

Durandus Korneius Dijken

Mustafa Ümit Arabul

Pieter Verhoeff

Rifat A M Hikmet

Bart M De Boer

Theodorus P H G Jansen

Jeroen Veen

Mischa Megens

André Albert Hendrik Jan Immink

Josephus A H M Kahlman

A method for determining an optimized weighting of an encoder and decoder network; the method comprising:

Aligning a distorted image

The disclosure relates to determining information about a target structure formed on a substrate using a lithographic process. In one arrangement, a cantilever probe is provided having a cantilever arm and a probe element. The probe element extends from the cantilever arm towards the target structure. Ultrasonic waves are generated in the cantilever probe. The ultrasonic waves propagate through the probe element into the target structure and reflect back from the target structure into the probe element or into a further probe element extending from the cantilever arm. The reflected ultrasonic waves are detected and used to determine information about the target structure.

Method and metrology tool for determining information about a target structure, and cantilever probe

An electron beam inspection apparatus, the apparatus including a plurality of electron beam columns, each electron beam column configured to provide an electron beam and detect scattered or secondary electrons from an object, and an actuator system configured to move one or more of the electron beam columns relative to another one or more of the electron beam columns, the actuator system including a plurality of first movable structures at least partly overlapping a plurality of second movable structures, the first and second movable structures supporting the plurality of electron beam columns.

Method and apparatus for inspection

A direct write exposure apparatus configured to process a plurality of substrates, the apparatus including: a substrate holder configured to hold a substrate having a usable patterning area; a patterning system configured to project different patterns onto the substrate; a processing system configured to: determine a first combination of one or more patterns that are to be applied on a first substrate of the plurality of substrates; and determine a second, different combination of one or more patterns that are to be applied on a second, subsequent, substrate of the plurality of substrates.

Determining the combination of patterns to be applied to a substrate in a lithography step

The invention relates to a method for the detection of target components that comprise label particles, for example magnetic particles (). The method includes (a) collecting the target components at a binding surface () of a carrier (); (b) directing an input light beam (L, L, L) into the carrier such that it is totally internally reflected in an investigation region () at the binding surface (); and (c) determining the amount of light of an output light beam (L, L, L) that comprises at least some of the totally internally reflected light. Evanescent light generated during the total internal reflection is affected (absorbed, scattered) by target components and/or label particles () at the binding surface () and will therefore be missing in the output light beam (L). This can be used to determine the amount of target components at the binding surface () from the amount of light in the output light beam (L, L, L). A magnetic field generator () is optionally used to generate a magnetic field (B) at the binding surface () by which magnetic label particles () can be manipulated, for example attracted or repelled.

Method of detecting label particles

The invention relates to a carrier with a binding surface at which target components that comprise label particles, for example magnetic particles, can collect and optionally bind to specific capture elements. An input light beam (L) is transmitted into the carrier and totally internally reflected at the binding surface. The amount of light in the output light beam (L) and optionally also of fluorescence light emitted by target components at the binding surface is then detected by a light detector. Evanescent light generated during the total internal reflection is affected (absorbed, scattered) by target components and/or label particles at the binding surface and will therefore be missing in the output light beam (L). This can be used to determine the amount of target components at the binding surface from the amount of light in the output light beam (L, L, L). A magnetic field generator is optionally used to generate a magnetic field (B) at the binding surface by which magnetic label particles can be manipulated, for example attracted or repelled.

Carrier for detecting label particles

A pick-and-place tool including a plurality of movable holder structures, and a plurality of pick-and-place structures, each holder structure accommodating two or more of the pick-and-place structures, wherein at least one of the two or more pick-and-place structures of a respective holder structure is able to move along a respective holder structure independently from another at least one of the two or more pick-and-place structures of the respective holder structure, and wherein each pick-and-place structure includes a pick-up element configured to pick up a donor component at a donor structure and place the donor component an acceptor structure.

Pick-and-place tool having multiple pick up elements

An electron beam inspection apparatus, the apparatus including a plurality of electron beam columns, each electron beam column configured to provide an electron beam and detect scattered or secondary electrons from an object, and an actuator system configured to move one or more of the electron beam columns relative to another one or more of the electron beam columns. The actuator system may include a plurality of first movable structures at least partly overlapping a plurality of second movable structures, the first and second movable structures supporting the plurality of electron beam columns.

An exposure apparatus including: a substrate holder constructed to support a substrate; a patterning device configured to provide radiation modulated according to a desired pattern, the patterning device including a plurality of two-dimensional arrays of radiation sources, each radiation source configured to emit a radiation beam; a projection system configured to project the modulated radiation onto the substrate, the projection system including a plurality of optical elements arranged side by side and arranged such that a two-dimensional array of radiation beams from a two-dimensional array of radiation sources impinges a single optical element of the plurality of optical elements; and an actuator configured to provide relative motion between the substrate and the plurality of two-dimensional arrays of radiation sources in a scanning direction to expose the substrate.

Method and apparatus for direct write maskless lithography

A method and apparatus to provide a plurality of radiation beams modulated according to at least two sub patterns of a pattern using radiation sources, the radiation sources producing radiation beams of at least two spot sizes such that each of the radiation beams having a same spot size of the at least two spot sizes is used to produce one of the at least two sub patterns, project the plurality of beams onto a substrate, and provide relative motion between the substrate and the plurality of radiation sources, in a scanning direction to expose the substrate. A method and apparatus to provide radiation modulated according to a desired pattern using a plurality of rows of two-dimensional arrays of radiation sources, project the modulated radiation onto a substrate using a projection system, and remove fluid from between the projection system and the substrate using one or more fluid removal units.

A target structure (T) made by lithography or used in lithography is inspected by irradiating the structure at least a first time with EUV radiation () generated by inverse Compton scattering. Radiation () scattered by the target structure in reflection or transmission is detected () and properties of the target structure are calculated by a processor () based on the detected scattered radiation. The radiation may have a first wavelength in the EUV range of 0.1 nm to 125 nm. Using the same source and controlling an electron energy, the structure may be irradiated multiple times with different wavelengths within the EUV range, and/or with shorter (x-ray) wavelengths and/or with longer (UV, visible) wavelengths. By rapid switching of electron energy in the inverse Compton scattering source, irradiation at different wavelengths can be performed several times per second.

Metrology methods, radiation source, metrology apparatus and device manufacturing method

An exposure apparatus including: a substrate holder constructed to support a substrate; a patterning device configured to provide radiation modulated according to a desired pattern, the patterning device including an array of radiation source modules configured to project the modulated radiation onto a respective array of exposure regions on the substrate; and a distributed processing system configured to process projection related data to enable the projection of the desired pattern onto the substrate, the distributed processing system including at least one central processing unit and a plurality of module processing units each associated with a respective radiation source module.

Apparatus for direct write maskless lithography

An illumination system has a microLED array. The microLED arrayis imaged or placed very close to a phosphor coated glass discwhich upconverts the light from the microLED array into a narrow band emission. The plate has at least two different photoluminescent materials arranged to be illuminated by the microLED array and to thereby emit output light. The different photoluminescent materials have different emission spectral properties of the output light, e.g. different center wavelength and optionally different bandwidth. Illumination of different photoluminescent materials by the illumination sources is selectable, by selective activation of the microLEDs or by movement of the photoluminescent materials relative to the illumination sources, to provide different illumination of the different photoluminescent materials. This provides tunable spectral properties of the output light. Selectively configurable filtersare arranged to filter the output light in accordance with the selected illumination of the different photoluminescent materials.

Illumination system for a lithographic or inspection apparatus

An X-ray detector () includes a light detection arrangement () such as a CMOS photodetector, a scintillator layer () such as a CsI:Tl layer, a reflector layer () and a light emission layer () interposed between the scintillator layer () and the reflector layer (). The light emission layer () may include an OLED and may have a thickness of less than 50 &#x3bc;m. Thereby, a sensitivity and resolution of the X-ray detector may be improved.

X-ray detector with improved spatial gain uniformity and resolution and method of fabricating such X-ray detector

Growing community of inventors

Eindhoven, Netherlands

Coen Adrianus Verschuren