National Technology & Engineering Solutions of Sandia, LLC

Sandia Corporation

Qorvo US, Inc.

Cody M Washburn

David R Wheeler

Timothy N Lambert

David Bruce Burckel

Tarak A Railkar

Christopher T Rodenbeck

Patrick Sean Finnegan

Edward Steven Jimenez, Jr

Ronen Polsky

Susan M Brozik

Jerry D Strother

Christopher Dyck

John Cates

Lee Taylor Massey

Charles R Martin

Michael Randolph Satches

Jennifer Marie Strong

A computer-implemented method of reconstructing boundaries from a computed tomography (CT) image dataset is provided. The method comprises receiving CT image data and applying a number of image filters to the CT image data. A numerical derivative is applied to the filtered CT image data to flatten and suppress non-edge regions that do not correspond to edges. Numerical derivative values are clipped to a specified range to reduce artifacts and noise, and an X-ray image is reconstructed according to the image filters and clipped numerical derivative values.

Computed tomography approach to edge reconstruction

Described herein is an additive manufacturing apparatus that is well-suited for constructing piezoelectric sensors. The additive manufacturing apparatus includes an extrusion nozzle formed of a conductive material such as aluminum. The extrusion nozzle has a channel by way of which printing material exits the extrusion nozzle, wherein a build plate is configured to receive the printing material responsive to the printing material exiting the extrusion nozzle. An arc suppressor formed of a semiconductor is coupled to the extrusion nozzle and is configured to dissipate excess charge that would otherwise exist on the extrusion nozzle when a relatively high bias voltage is applied to the extrusion nozzle. Thus, the arc suppressor mitigates arcing between the extrusion nozzle and the build plate. Arc suppressing gas is also optionally introduced into a printing region, thereby further mitigating arcing between the extrusion nozzle and the build plate.

Additive manufacturing print-heads for exotic material applications

The various technologies presented herein relate to formation of carbon micromechanical systems (CMEMS), wherein the CMEMS comprise multiple layers of carbon structures and are formed using a plurality of photoresist precursors that are processed to form carbon. The various embodiments can be utilized in producing a plurality of CMEMS with full production level fabrication, e.g., 6 inch wafers can be processed. A pyrolyzed layer of carbon is lithographically defined after pyrolysis, wherein the post-pyrolysis etch process can produce carbon structures having repeatable and accurate device geometries, with straight sidewalls. A sacrificial layer can be applied to facilitate separation of a first carbon layer from a second carbon layer, wherein, upon pyrolysis to form the second carbon layer and lithography thereof, the sacrificial layer is removed to form a CMEMS comprising a first carbon layer (e.g., comprising bottom contacts) located beneath a second carbon layer (e.g., a mechanical layer).

Fabrication of multilayered carbon MEMS devices

Various technologies presented herein relate to forming one or more heat dissipating structures (e.g., heat spreaders and/or heat sinks) on a substrate, wherein the substrate forms part of an electronic component. The heat dissipating structures are formed from graphene, with advantage being taken of the high thermal conductivity of graphene. The graphene (e.g., in flake form) is attached to a diazonium molecule, and further, the diazonium molecule is utilized to attach the graphene to material forming the substrate. A surface of the substrate is treated to comprise oxide-containing regions and also oxide-free regions having underlying silicon exposed. The diazonium molecule attaches to the oxide-free regions, wherein the diazonium molecule bonds (e.g., covalently) to the exposed silicon. Attachment of the diazonium plus graphene molecule is optionally repeated to enable formation of a heat dissipating structure of a required height.

Graphene heat dissipating structure

A microporous carbon scaffold is produced by lithographically patterning a carbon-containing photoresist, followed by pyrolysis of the developed resist structure. Prior to exposure, the photoresist is loaded with a nanoparticulate material. After pyrolysis, the nanonparticulate material is dispersed in, and intimately mixed with, the carbonaceous material of the scaffold, thereby yielding a carbon composite structure.

Lithographically defined microporous carbon-composite structures

A lithographic method is used to fabricate porous carbon structures that can provide electrochemical electrodes having high surface area with uniform and controllable dimensions, providing enormous flexibility to tailor the electrodes toward specific applications. Metal nanoparticles deposited on the surface of the porous carbon electrodes exhibit ultra small dimensions with uniform size distribution. The resulting electrodes are rugged, electrically conductive and show excellent electrochemical behavior.

Lithographically defined microporous carbon structures

Growing community of inventors

Albuquerque, NM, United States of America

Cody M Washburn