International Business Machines Corporation

Cody John Murray

Ekmini Anuja De Silva

Alex Richard Hubbard

Karen Elizabeth Petrillo

Nelson M Felix

Christopher Frederick Robinson

Richard C Johnson

Luciana Meli

Nikhil Jain

Vinay Pai

Lawrence Alfred Clevenger

Fee Li Lie

Marc Adam Bergendahl

Chi-Chun Liu

Gauri V Karve

John Christopher Arnold

Spyridon Skordas

Somnath Ghosh

Dominik Metzler

In an approach, a processor receives device identification information corresponding to at least one device local to a location of a transaction. A processor receives notification of an infected user. A processor determines that the infected user is associated with the transaction. A processor identifies a second user from the device identification information. A processor sends a notification to the second user.

Contact tracing utilizing device signatures captured during transactions

Embodiments are disclosed for a method. The method includes generating a correction datastore indicating shifts in magnitude representing corresponding characters that uniquely identify hardware comprising a computer processing chip. The method further includes generating security masks based on a correction file. Additionally, the method includes using a correction process for the computer processing chip. The generated security masks include corresponding overlays representing the shifts in magnitude with respect to corresponding product masks for the computer processing chip. The method also includes generating the computer processing chip using the security masks and the product masks.

Secure identification of wafer and chip

A method of manufacturing a semiconductor device is provided. The method includes forming a plurality of metal lines on substrate, forming a sacrificial dielectric material layer between the metal lines, forming a hardmask over at least one of the metal lines, etching at least one of the metal lines that is not covered by the hardmask, treating the sacrificial dielectric material layer to soften the layer. The method also includes removing the treated sacrificial dielectric material layer.

Spin on scaffold film for forming topvia

Techniques for using open frame (E0) exposures for lithographic tool track/cluster monitoring are provided. In one aspect, a method for monitoring a lithographic process includes: performing open frame exposures E0 of at least one wafer coated with a photoresist using a photolithography tool; baking and developing the at least one wafer; performing a defect inspection of the at least one wafer to generate a haze map; grouping haze data from the haze map; and analyzing the haze data to identify a maximum E0 response dose E'.

Using E0 exposures for track/cluster monitoring

Techniques for lithography process delay characterization and effective dose compensation are provided. In one aspect, a method of analyzing a lithography process includes: applying a photoresist to a wafer; performing a post-apply bake of the photoresist; patterning the photoresist with sequences of open frame base line exposures performed at doses of from about 92% E0 to about 98% E0, and ranges therebetween, at multiple fields of the wafer separated by intervening programmed delay intervals, wherein E0 is the photoresist dose-to-clear; performing a post-exposure bake of the photoresist; developing the photoresist; performing a full wafer inspection to generate a grayscale map of the wafer; and analyzing the grayscale map to determine whether the intervening programmed delay intervals had an effect on the open frame base line exposures during the lithography process. Exposure dose compensation can then be applied to maintain a constant effective dose.

Lithography process delay characterization and effective dose compensation

A method includes monitoring with at least one monitoring tool one or more activities associated with an enterprise. The method further includes analyzing data input from the at least one monitoring tool of the one or more activities, and determining, based on analytics performed on the data input and an implemented policy, when the one or more activities qualifies as an incident. A remedial response responsive to the incident is initiated. The monitoring, analyzing, determining and initiating steps are performed by at least one processing device including a processor operatively coupled to a memory.

Cognitive system for automatic risk assessment, solution identification, and action enablement

A method of optimizing a lithographic process for semiconductor fabrication includes determining that a semiconductor wafer experienced a photoresist exposure delay. At least one operating parameter of a post exposure baking process is adjusted based on the semiconductor wafer having experienced the photoresist exposure delay. The post exposure baking process is performed on the semiconductor wafer utilizing the adjusted at least one operating parameter.

Growing community of inventors

Scotia, NY, United States of America

Cody John Murray