Semiconductor Technologies & Instruments Pte. Ltd.

August Technology Corp.

Semiconductor Technology & Instruments, Inc.

Clyde Maxwell Guest

Charles K Harris

Chu-Yin Chang

Rajiv Roy

John Mark Thornell

Thomas Casey Carrington

Weerakiat Wahawisan

Hak Chuah Sim

Sanjeev Mathur

Ramiro Castellanos-Nolasco

Younes Chtioui

A system for processing image data, such as an image of a die cut from a silicon wafer, is provided. The system includes an irregular edge detection system, which can locate edge data of a feature of the image data, such as the edge of a probe mark in a bond pad. A feature area calculation system is connected to the irregular edge detection system, such as by accessing data stored by the irregular edge detection system. The feature area calculation system can receive the edge data of the feature and determining the area of the feature, such as by summing normalized pixel area values. The irregular edge detection system uses interpolation to locate edges that occur between the centerpoints of adjacent pixels.

System and method for locating irregular edges in image data

A system for inspecting components is provided. The system includes an axial lighting system that illuminates the component with axial lighting to allow one or more features of the component to be located, such as by causing protruding features to be brighter than the background and recessed features to be darker than the background. An off-axis lighting system illuminates the component with off-axis lighting in the absence of the axial lighting to allow the component to be inspected to locate one or more features, such as a bump contact.

System and method for inspection using off-angle lighting

A system for inspecting a component, such as a die formed on a silicon wafer, is provided. The system includes a two dimensional inspection system that can locate one or more features, such as bump contacts on the die, and which can also generate feature coordinate data. The system also includes a three dimensional inspection system that is connected to the two dimensional inspection system, such as through an operating system of a processor. The three dimensional inspection system receives the feature coordinate data and generates inspection control data.

System and method for inspecting bumped wafers

A system for locating features in image data is provided. The system includes a first component system. The first component system compares first component data, which can be pixel data of a first user-selected component of the feature, to first test image data, which can be selected by scanning image data of a device, such as a die cut from a silicon wafer. The system also includes second component system that is connected to the first component system, such as through data memory locations of a processor. The second component system compares second component data to second test image data if the first component system finds a match between the first component data and the first test image data. The second test image data is selected based upon the first test image data, such as by using a known coordinate relationship between pixels of the first component data and the second component data.

System and method for locating image features

A system for selecting reference die images, such as for use with a visual die inspection system, is provided. The system includes a die image comparator, which compares a first die image to a second die image in order to create a difference image that contains only the differences between the two die images. The system also includes a difference image analysis system that receives data from the die image comparator. The difference image analysis system analyzes the difference image and determines whether there are any features of the difference image that indicate that either the first die image or the second die image should not be used as a reference die image.

Growing community of inventors

Plano, TX, United States of America

Clyde Maxwell Guest