Other

Tyco Electronics Corporation

Clyde Benton Mabry, Iii

Sherif I Kamel

Jonathan Conrad Cornelius

John Anthony Kizis

Robert Michael Ballance

Ian Paul Atkins

George W Kayser

An overvoltage protection device includes a housing including a first substantially planar electrical contact surface and a sidewall. The housing defines a cavity therein and has an opening in communication with the cavity. An electrode member of the device includes a second substantially planar electrical contact surface facing the first electrical contact surface and disposed within the cavity. A portion of the electrode member extends out of the cavity and through the opening. A wafer formed of varistor material and having first and second opposed, substantially planar wafer surfaces is positioned within the cavity and between the first and second electrical contact surfaces with the first and second wafer surfaces engaging the first and second electrical contact surfaces, respectively.

Overvoltage protection device including wafer of varistor material

Flashover protection covers are provided in a continuous length for covering power line spans between supporting structures. A flexible panel includes an inner surface and generally parallel opposite edge portions configured to be joined together to enclose a power line. Stress reduction hinges formed within the flashover protection covers facilitate reduced-stress bending of the flashover protection covers.

Flashover protection cover with stress reduction hinges

An overvoltage protection device includes a first electrode member having a first substantially planar contact surface and a second electrode member having a second substantially planar contact surface facing the first contact surface. A wafer formed of varistor material and having first and second opposed, substantially planar wafer surfaces is positioned between the first and second contact surfaces with the first and second wafer surfaces engaging the first and second contact surfaces, respectively. The contact surfaces may apply a load to the wafer surfaces. Preferably, the electrode members have a combined thermal mass which is substantially greater than a thermal mass of the wafer. The wafer may be formed by slicing a rod of varistor material. The device may include a housing including the first substantially planar contact surface and a sidewall, the housing defining a cavity within which the second electrode is disposed.

Growing community of inventors

Greensboro, NC, United States of America

Clyde Benton Mabry, Iii