Texas Instruments Corporation

Clyde A King

Lawrence D Dyer

Jerry B Medders

Vikki S Simpson

Tom G Gullett

Douglas W Bilderback

Bobby R Robbins

Arthur R Clark

Danny R Newton

An edge polishing system (20, 320) and method for edge polishing semiconductor wafers is disclosed. The system (20, 320) includes a loader (22, 326), a polisher (24, 328), an unloader (26, 330), and a controller (28, 335). The method includes the steps of loading wafers (28), and spacers (30) into a loader (22) to form a stack (36), moving the stack (36) into a polisher (24) and causing polisher (24) to polish the stack (36), then moving the stack (36) to an unloader (26), which semiautomatically removes the wafers (28) and spacers (30). The system (20) may include a controller (28) for entering the appropriate commands.

Semiconductor wafer edge polishing system and method

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Bells, TX, United States of America

Clyde A King