The Penn State Research Foundation

Qortek, Inc.

Other

Littlefuse Ireland Development Company Limited

Recapping, Inc.

Clive A Randall

Amanda Lou Baker

Thomas R Shrout

Michael T Lanagan

Michael Randall

Susan Trolier McKinstry

Jing Guo

Hanzheng Guo

Daniel J Skamser

Joseph P Dougherty

Azizuddin Tajuddin

Ramakrishnan Rajagopalan

Pascal I Pinceloup

Hajime Nagata

Safakcan Tuncdemir

Richard Eitel

Ahmet Erkan Gurdal

Gareth J Knowles

Leslie E Cross

Neil McLoughlin

Susan Trolier-McKinstry

Kenji Uchino

Aram Yang

Tomohiro Sogabe

James J Beeson

Sei-Joo Jang

Jose Agraz

Ulagaraj Selvaraj

Seung-Eek Park

Alfons Kelnberger

Ramesh Raghavendra

Umesh Kumar

Sea-Fue Wang

Wei-Ting Chen

Sinan Dursun

Kamau Wa Gachigi

Philip M Pruna

Selda Nayir

John P Witham

Daudi Waryoba

Merrilea J Mayo

Rajendra N Basu

Nathanael Bennink

Ryan Thayer

Wei Ren

Hyuk-Joon Youn

Jonathan Van Tassel

Yi Fang

Seung-Ho Park

Song Won Ko

James J Baeson

Niall J Donnelly

Embodiments can relate to an improved hydroflux, additive or electroless plating assisted densification cold sintering process to densify powdered metals at lower compaction pressures and lower temperatures (e.g., 520 MPa and 140° C.). The process can involve inducing dissolution precipitation mechanisms at powder interfaces by introducing a transport phase (formed by the introduction of water during the process to suppress melting temperatures) that is not an aqueous solution. Particle interfaces in the cold sinter fuse together by the presence of the additional transport phase, thereby reducing the temperatures and pressures needed for compaction. Some embodiments involve the use of elements to form a eutectic at the desired low temperature, thereby stabilizing certain crystal structure shapes of isometric crystal systems, inducing rapid densification, and facilitating pore smoothing. Embodiments of the process can be used to generate a green compact via sintering that exhibits improved green strength.

Cold sintering process for densification and sintering of powdered metals

Cold sintering of materials includes using a process of combining at least one inorganic compound, e.g., ceramic, in particle form with a solvent that can partially solubilize the inorganic compound to form a mixture; and applying pressure and a low temperature to the mixture to evaporate the solvent and densify the at least one inorganic compound to form sintered materials.

Cold sintering ceramics and composites

A wire-free multilayer biomorph device is provided where the layers are bonded without use of adhesive. The device includes a plurality of stacked perforated metal plates with interposed transductive assembly layers. The perforated metal plates and transductive assembly layers are bonded by a conductive metal ink that is subject to a thermal cycle process. Electrical connection of the perforated metal plates and transductive assembly are realized through structural connectors thru-connectors thereby obviating the need for wiring.

Extreme environment capable multilaminar transductive biomorph device

A composition includes at least one Pb/Ni/Nb - Pb/Mg/W - Pb/Zr/Ti mixed oxide. A piezoelectric device may be made by providing at least two layers comprising the composition and coated with an outer electrode material; providing a plurality of layers comprising the composition and coated with an inner electrode material; combining or stacking a plurality of layers coated with inner electrode materials between two outer electrodes; and sintering or co-firing the inner electrode materials and outer electrode materials at a temperature at or below about 1000&#xb0; C.

Hard piezoelectric ceramic composition for multilayer piezoelectric transformers

Cold sintering composites and ceramics

Dielectric compositions that include compound of the formula [(M')(A&#x2032;)][(M&#x2033;),(B&#x2033;)(C&#x2033;)]O(V)and protonated dielectric compositions that include a protonated dielectric compound within the formula [(M&#x2032;)(A&#x2032;)](M&#x2033;)(B&#x2033;)(C&#x2033;)]O(V)(H)are disclosed. Composite materials that employ one or more of these dielectric compounds together with an electrolyte also are disclosed. Composite material that employs one or more of these dielectric compounds together with an electrochemally active material also are disclosed.

High energy density ionic dielectric materials and devices

The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiO3 multilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiO3 dielectric layers and LaNiO3 internal electrodes are prepared, enabling dielectric layer thicknesses of 1 &#x3bc;&#x3bc;m or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used.

Microcontact printed thin film capacitors

The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiOmultilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiOdielectric layers and LaNiOinternal electrodes are prepared, enabling dielectric layer thicknesses of 1 &#x3bc;m or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used.

Metal solutions such as copper and nickel suitable for chemical solution deposition (CSD) are disclosed, and their manufacture into low resistivity thin metal films is disclosed. The films may be thermal processed at relatively low temperatures and may be co-fired with ultra low fire high K ceramic dielectrics.

Thin metal film conductors and their manufacture

A piezoelectric ultrasonic motor having 2-dimensional positioning movement includes a stator. The stator includes a piezoelectric ceramic bar and an electrode disposed on the bar. Each bar includes two wings that are separated by a predetermined angle to form a predetermined shape. A power source is used to apply a voltage to the stator to excite a bending mode vibration in the each of the wings, and the combined motion of the two wings produces an elliptical motion at a tip of the wing. A load is operatively connected to the stator, such that a portion of the load in contact with the stator is driven to move linearly through a frictional force between the load and the stator, due to the elliptical motion at the tip of the wing.

Piezoelectric ultrasonic motor for 2-dimensional positioning

Co-fired multilayer piezoelectric ceramic materials with base metal electrodes based on copper, copper alloy, are found as an effective approach to manufacture low cost multilayer piezoelectrics. The method of the invention is performed at low firing temperature and without the oxidation of base metal or reduction of ceramic components. A variety of ceramic materials may be used and copper is the preferred base metal in the multi-layer piezoelectric devices of the invention. This copper has additional protection against oxidation with a small inorganic coating on the surface. With such protection, the binder and other organics can also be efficiently removed and produce superior performance in the piezoelectric structured devices.

Method of preparing multilayered piezoelectric ceramic material

A single or multi-component particulate tape and a method and apparatus for making the single or multi-component particulate tape. More particularly, the present invention relates to a single or multi-component particulate tape and method for making a single or multi-component particulate tape using the process of electrophoretic deposition. These tapes and tapes produced using these methods can be used to make single or multi-layer electronic devices such as capacitors, varistors, inductors, and the like, as well as structural laminate components. The method comprises casting a tape by electrophoretic deposition and also or alternatively depositing additional functional materials on or into the cast tape by electrophoresis.

Fabrication of particulate tapes by electrophoretic deposition

An IPD has a varistor of electrodes and a ZnO dielectric. A capacitor includes electrodes and a dielectric that has oxides of bismuth, magnesium, and niobium having a pyrochlore structure of type A B O . The materials are applied as wet layers and are sintered for integrated production.

Integrated passive device and method for producing such a device

The present invention is directed to a new family of high Curie temperature, morphotropic phase boundary systems, based on the perovskite solid solution having the general formula (1&minus;x)BiMeO -xPbTiO , where Me is a suitably sized cation or combination of cations and x is a molar fraction. The perovskite systems of the present invention offer room temperature properties analogous to, and high temperature properties superior to, commercially available PZT compositions. The perovskite of this invention exhibits a MPB between the rhombohedral and tetragonal phases. Further dopant strategies may be used for property optimization of the perovskite systems.

Perovskite materials for high temperature and high performance actuators and transducers

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State College, PA, United States of America

Clive A Randall