Applied Materials, Inc.

Clinton P Sakata

Brian J Brown

Hui W Chen

Jim Kellogg Atkinson

Jianshe Tang

Tomohiko Kitajima

Edward Golubovsky

Yufei Chen

Yunshuang Ding

Replaceable substrate carrier interfacing film

In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a buff pad having a diameter smaller than a diameter of the substrate; and (3) a swing arm coupled to the buff pad and configured to position and rotate the buff pad along the front side of the substrate, and control an amount of force applied by the buff pad against the front side of the substrate during cleaning. The substrate chuck, buff pad assembly and swing arm are configured to buff clean the substrate. Numerous additional aspects are disclosed.

Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaning

A buff module and method for using the same are provided. In one embodiment, a buff module includes housing having an interior volume, a plurality of drive rollers and a pair of buff heads. The drive rollers are arranged to rotate a substrate within the interior volume on a substantially horizontal axis. The buff heads are disposed in the housing, each buff head rotatable on an axis substantially aligned with the horizontal axis and movable to a position substantially parallel with the horizontal axis.

Double sided buff module for post CMP cleaning

Chuck carrier film

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San Jose, CA, United States of America

Clinton P Sakata