Endgate LLC

Endwave Corporation

Pacific Monolithics

Endlink Corporation

Endgate Technology Corporation

Clifford A Mohwinkel

Mark V Faulkner

Edward Bryant Stoneham

Edwin F Johnson

Douglas Gene Lockie

Bert C Henderson

Raymond R Blasing

Edward A Keible

Mark J Vaughan

Paul Likins

Malkiat S Nijjar

Gerd R Ley

Mark Van Ness Faulkner

Edward B Anderson

A wireless communication system that provides energy efficient, high bandwidth and low cost wireless communication. In one embodiment, the communication system utilizes a fan out, pencil beam arrangement in which electro-magnetic energy is transmitted from a hub to customer premises equipment (CPE) with a fan or similar antenna and from the CPEs to the hub via pencil beam antennas. The pencil beam antennas provided higher link margin. The hub may include a shared aperture antenna device for receiving pencil beam transmissions from the CPEs. A shared aperture antenna device may also be used for transmission from the hub to the CPEs.

Wireless point to multi-point communication apparatus and method

An improved apparatus and method for the placement and bonding of a die on a substrate includes a movable die holder, a movable substrate holder, a pivoting transfer arm that picks a die from the movable die holder and transfers the die to a position adjacent the movable substrate holder, and a bondhead assembly for picking the die from the transfer arm and then bonding the die to the substrate.

Apparatus and method for the placement and bonding of a die on a substrate

A via termination for a microstrip transmission line formed on a substrate includes a termination resistor that connects an end of the signal conductor to a backside ground plane through a via. Two open-circuit stubs are also formed on the first face of the substrate, one stub on each side of the termination resistor. A compensation resistor on the first face of the substrate connects the end of the signal conductor to each open-circuit stub. The load resistor is equal to the characteristic impedance of the transmission line and the compensation resistors are each equal to twice the characteristic impedance. The combined termination ideally exhibits a real impedance equal to the characteristic impedance over a wide frequency range.

Impedance-compensating circuit

A means of connecting a plurality of essentially identical active devices is presented for the purpose of multifunction and multiple function operation. These devices, mounted on a chip, are flip-mounted onto a circuit formed on a base substrate and having large passive elements. Push-pull amplifiers are presented as examples in which the multiple function operation is the combining of amplifiers whose active devices are on a single chip. Electromagnetic coupling, impedance matching and signal transmission are variously provided by the use of strip lines, slotlines, coplanar waveguides, and a slotline converted into a coplanar waveguide.

Push-pull amplifier with dual coplanar transmission line

A slot line band reject pass filter including a substrate of insulating material having slot line primary conductors formed thereon. One or more supplemental conductors are preferably coupled to the slot line primary conductors to achieve rejection of a desired frequency. Several embodiments of supplemental conductors are disclosed including substantially closed loop and non loop segments that extend in a range from parallel to perpendicular from the primary conductors. The supplemental conductors may be directly or electromagnetically coupled, or both.

Slot line band reject filter

A high frequency circuit structure including a base substrate having a planar face, a first base slotline mounted on the base substrate face and consisting of first and second, spaced-apart coplanar base conductors, and a circuit chip flip-mounted on the base substrate. The circuit chip include a chip substrate having a planar face facing the planar face of the base substrate. A slotline resident on the chip is flip mounted onto the base slotline. Input and output connections made according to the invention can be used to provide connections to an intermediate circuit resident on either the chip or the base substrate. A second chip slotline may be electrically in series or parallel with the first chip slotline.

Slotline-to-slotline mounted flip chip

First and second spaced-apart planar circuit ground conductors are formed on a base substrate. Multiple stages of an amplifier each have a field effect transistor (FET) flip mounted onto the substrate. A signal-return line couples the sources of the FETs together and functions as a radio frequency (RF) grounds for the amplifier. Direct-current-blocking coplanar couplers couple the amplifier input and output to external circuits. A single voltage supply applies a bias voltage to the drains of the FETs. A source resistance device couples each source terminal to circuit ground. The source resistance devices may be formed of two series-connected resistors. The gate of each FET is coupled to one of the circuit ground conductors through one of the source resistors. The other source resistor thereby provides a gate-to-source voltage for biasing the FET. Alternative embodiments provide a community bias circuit in which signal-return lines of transistors conducting different signals are interconnected and coupled to the bias circuit ground.

Multiple stage self-biasing RF transistor circuit

The preferred embodiment of the present invention is a communications apparatus which includes a first transmitting antenna array (15A) having a transmitting antenna (16) which is dedicated to serve only a first sector (12). Similarly, a second transmitting antenna array (17A) having a transmitting antenna (18) is dedicated to serve only a second sector (14). Each of the transmitting antenna arrays (15A, 17A) have a beamwidth (19) of generally less than fifteen degrees. Both the first and the second transmitting antenna arrays (15A, 17A) emanate shaped beams which are alternately polarized to ensure the isolation of beams that serve adjacent sectors.

Sectorized multi-function communication system

Two or three conductor coplanar transmission lines and lossy coplanar resistive films are formed on a surface of a substrate. The resistive film dimensions and resistivity are selected to suppress various spurious electromagnetic modes within and around the substrate. The resistive films may be positioned along the outer edges of the transmission lines or between the transmission line conductors. The resistive film may have regular spaced openings for producing an average resistivity different than that of a continuous resistive film. In one embodiment, a signal conductor has a serpentine shape and resistive film elements are positioned between adjacent sections of the signal conductor. In another embodiment, interdigitated resistive film elements extend between transmission line conductors.

Coplanar microwave circuit having suppression of undesired modes

A slot line band pass filter formed on a dielectric substrate. In one embodiment, the filter includes input and output positive and negative signal conductors and resonators for coupling a signal of a desired frequency between input and output conductors. Various resonator arrangements are disclosed. In another embodiment, a filter having a resonator connected to and disposed between positive and negative conductors is taught. In yet other embodiments, filters having loop resonators are disclosed.

Slot line band pass filter

First and second slotlines are mounted on an electrically insulating substrate having a planar face with a connection region. Each slotline has first and second, spaced-apart coplanar conductors that extend into the connection region. A fifth, ground conductor, also mounted on the substrate face, is spaced from and coplanar with the first and second slotlines and has a proximal portion in the connection region. A chip circuit includes first and second field-effect transistors (FETs) flip mounted in the connection region to all five conductors. The gates of the FETs are connected to the first slotline for receiving an input signal. The drains are connected to the second slotline for outputting the signal amplified by the transistors. The sources of the FETs are connected to the fifth conductor. This general configuration can be modified for use as an amplifier, oscillator, frequency multiplier or mixer. The slotline may divide into parallel slotline portions for providing plural circuits in parallel with distributed impedance matching. A slotline may loop back from the connection region to provide a choice for impedance matching, and a portion of the fifth conductor may extend between slotline conductors to provide capacitive coupling.

Slotline-mounted flip chip

Slotline-mounted flip chip structures

A means of connecting a plurality of essentially identical active devices is presented for the purpose of multifunction and multiple function operation. These devices, mounted on a chip, are flip-mounted to a circuit motherboard having large passive elements. A push-pull amplifier is presented as an example in which the multiple function operation is the combining of amplifiers whose active devices are on a single chip. The electromagnetic coupling, impedance matching and signal transmission are variously provided by the use of striplines, slotlines, coplanar waveguides, and a slotline converted into a coplanar waveguide.

Circuit structure having a matrix of active devices

A radio-frequency power amplifier includes a multiple-FET chip that is flip-mounted on a connection region of a substrate. An input impedance-matching network is also mounted on the substrate. The network includes a coplanar waveguide having an elongate waveguide signal conductor for each gate terminal on the FET chip with a distal end spaced from the connection region and a proximal end in the connection region. The distal ends are connected to a single base input conductor. The proximal ends are flip-mounted to respective ones of gate terminals of the FET chip. A capacitor couples each of the input signal conductor distal ends to an adjacent ground conductor. The signal conductors and capacitors provide a selected impedance at a selected frequency. The capacitors may be on a separate chip flip-mounted to the coplanar transmission line conductors, and may be formed as coplanar waveguides with open-ended signal conductors or as overlay capacitors. An output coplanar waveguide includes, for each drain terminal, an output signal conductor having an end in the connection region that is electrically connected to the flip-mounted FET chip. This waveguide also has a length selected to provide desired impedance matching.

Flip-mounted impedance

Mixers assemblies including mixer cells, baluns, quadrature mixers and image reject mixers, etc. The mixer cell may contain CPW strip RF input and slot line strip LO input. LO signal return is provided through a flip-chip mounted to a mixer contact area and the CPW RF input is preferably coupled to the contact area through a distributed or flip-chip mounted capacitor. The use of two mixer cells in novel embodiments of quadrature and image reject mixers is disclosed. CPW to slot line power dividing baluns for use within and without such mixers are also disclosed.

Growing community of inventors

San Jose, CA, United States of America

Clifford A Mohwinkel