Motorola Corporation

Cliff J Scribner

Albert J Laninga

Timothy Lee Olson

James H Knapp

A semiconductor component includes a leadframe (11, 40) having leads (12, 41) and a ground plane (13, 42) wherein the ground plane (13, 42) has an opening (15, 45). A semiconductor substrate (21) is located in the opening (15, 45) and is approximately coplanar with the ground plane (13, 42). The coplanarity shortens the ground plane wire bonds (23) and improves the electrical performance of the semiconductor component.

Semiconductor component having leadframe with offset ground plane

A method of manufacturing a semiconductor component includes forming a vertical side seal for a runner in a first mold plate by mating a protrusion of the first mold plate with a protrusion of a second mold plate. As an encapsulating material is forced through the runner, the vertical side seal prevents an encapsulating material from leaking out of the edge of the runner.

Method of manufacturing a semiconductor component

Real time distance and pressure data of a plunger (35) relative to a mold compound is provided by a compensation assembly (29) in a mold press (10). The compensation assembly has a sliding block assembly (30) which moves substantially in the same direction as the plungers (35). The sliding block assembly (30) has pressure control cylinders (33) which limit the pressure plungers (35) can apply. If the pressure on the plungers (35) should exceed this limit, the plungers (35) retract towards the sliding block assembly (30). A sensor (37) is coupled between the sliding block assembly (30) and the plungers (35) to measure the distance the plungers have moved towards the sliding block assembly (30). In one application, the sensor (37) is formed from a linear voltage displacement transducer (LVDT) so the mold press (10) can have real time pressure and distance data.

Transfer molding press

A method for detecting mold plate information comprises, in a preferred embodiment, detecting external physical indicia (112) identify a mold plate. The external physical indicia (112) are preferably a pattern of holes or absence of holes formed in a corner protrusion (110), attached to the corner of a mold plate (104). The holes or absence thereof represent a binary sequence identifying the mold plate (104). Preferably, the holes are optically detected by detectors (204) mounted in the guide rail (202) of a mold press.

Method for detecting mold plate information and plate mold matching

A method for detecting orientation of a semiconductor package (11) having a cavity (19) formed in a lower surface is described. The semiconductor package (11) is positioned in a travel path (24) of a packaging process apparatus (23). An orientation support plate (17) is provided having a protrusion (18) that is designed to fit into the cavity (19) in the semiconductor package (11). The orientation support plate (17) is moved towards the semiconductor package and the protrusion (18) fits into the cavity (19) when the semiconductor package (11) is properly oriented, and the protrusion kicks the semiconductor package (11) out of the travel path (24) when the semiconductor package (11) is mis-oriented.

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Chandler, AZ, United States of America

Cliff J Scribner