Hewlett-packard Company

Cliff Harrison

Darrel W Poulter

Guenter Schkrohowsky

An enclosure for cooling device modules has metered air passages in an air duct system. The device modules which are of the form of air ducts are inserted into the air duct system of the enclosure and have exhaust air passages which are coupled to metered air passages in the air duct system of the enclosure. A source of reduced air pressure which is coupled to the air duct system of the enclosure draws air through the device module into the air duct system of the enclosure via the exhaust air passage of the device module and the metered air passage of the air duct system. The metered air passages are graduated in area as a function of their individual distances from the source of reduced air pressure to balance the air volume per unit of time at the respective metered air passages and are further sized in area to have a resistance to air flow which is greater than the air flow resistance of any of the device modules, to minimize changes in air volume rate in the air duct system whether or not device modules are in place in the air duct system of the enclosure.

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Eagle, ID, United States of America

Cliff Harrison