Siltronic Ag

Clemens Zapilko

Thomas Buschhardt

Guenter Schwab

Diego Feijoo

Klaus Roettger

Makoto Tabata

Thomas Jaeschke

Teruo Haibara

Yoshihiro Mori

Semiconductor wafers are cleaned, dried, and hydrophilized the following steps in the order stated:

Process for cleaning, drying and hydrophilizing a semiconductor wafer

Semiconductor wafers are CMP polished by polishing the rear side of the semiconductor wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is higher at the center than at the edge of the rear side; and polishing the front side of the wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is lower in the center of the front side than in an edge region of the front side.

Method for polishing a semiconductor wafer

A method for the wet-chemical treatment of a semiconductor wafer involves: a) rotating a semiconductor wafer; b) applying a cleaning liquid comprising gas bubbles having a diameter of 100 &#x3bc;m or less to the rotating wafer such that a liquid film forms on the wafer; c) exposing the rotating semiconductor wafer to a gas atmosphere containing a reactive gas; and d) removing the liquid film from the wafer.

Method for the wet-chemical treatment of a semiconductor wafer

Semiconductor wafers are cleaned using a cleaning solution containing an alkaline ammonium component in an initial composition, wherein the semiconductor wafer is brought into contact with the cleaning solution in an individual-wafer treatment, and in the course of cleaning hydrogen fluoride is added as further component to the cleaning solution, and the cleaning solution has at the end of cleaning, a composition that differs from the initial composition.

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Burghausen, Germany

Clemens Zapilko