Micron Communications, Inc.

Micron Technology Incorporated

Clay L Cirino

Mark E Tuttle

Rickie C Lake

Joseph P Mousseau

Joe P Mousseau

Methods of fixturing a flexible circuit substrate to a processing carrier are disclosed. In one implementation, the flexible circuit substrate and, processing carrier are attached with an adhesive film provided therebetween. The adhesive film comprises acrylic, silicone or a silicone acrylic blend in a preferred embodiment of the present invention. Ideally, substantially the total surface area of a first surface of the flexible circuit substrate is attached to the processing carrier. The flexible circuit substrate is removed from the adhesive film following processing thereof. In a preferred embodiment of the present invention, the adhesive film is monolithic. An electrical component is attached to the flexible circuit substrate and the flexible circuit substrate is encapsulated in accordance with one implementation of the present invention.

Methods of fixturing a flexible substrate and a processing carrier and methods of processing a flexible substrate

Printing systems and processes are described. In a preferred implementation, a print system includes a platen, a print device and a print substance vibrator. A substrate upon which printing is desired is placed on the platen and the print device is placed operably adjacent thereto. A print substance is applied over the print device and through at least one perforation in the print device and onto the substrate. In one aspect, the print device comprises a screen and the print system is configured for screen printing. In another more preferred aspect, the print device comprises a stencil and the print system is configured for stencil printing. The print device and substrate are then separated from one another while a vibrative force is imparted to the print substance by the print substance vibrator. In a preferred implementation, the print substance vibrator comprises a transducer which is configured to impart vibrative force having a frequency greater than about 2000 Hz, and even more preferably in the ultrasonic range. The preferred transducer can be connected with or to one or more of the print device, the platen, and/or the substrate.

Flip chip screen printing method

An encapsulation body for enclosing an electronic element is disclosed and which includes a first layer of a slow curing two-part epoxy which is in a flowable state; a second layer of material positioned outwardly of the first layer and which substantially retains the first layer of material on the electronic element while the first layer of material is in a flowable state; and a dam surrounding the electronic element, the first and second layers of material received within the dam.

Encapsulated electronic component and method for encapsulating an

Methods of fixturing a flexible circuit substrate to a processing carrier are disclosed. In one implementation, the flexible circuit substrate and processing carrier are attached with an adhesive film provided therebetween. The adhesive film comprises acrylic, silicone or a silicone acrylic blend in a preferred embodiment of the present invention. Ideally, substantially the total surface area of a first surface of the flexible circuit substrate is attached to the processing carrier. The flexible circuit substrate is removed from the adhesive film following processing thereof. In a preferred embodiment of the present invention, the adhesive film is monolithic. An electrical component is attached to the flexible circuit substrate and the flexible circuit substrate is encapsulated in accordance with one implementation of the present invention.

Methods of fixturing flexible circuit substrates and a processing

An enclosed electrical circuit and method for manufacturing the electrical circuit are provided. Initially a flexible substrate is formed with a plurality of electrical circuits. By way of example, each circuit can contain a conductive trace, a battery and a die, all in electrical communication. During the manufacturing process, a barrier is placed on the substrate and a curable encapsulant is poured into a cavity formed by the barrier and the substrate to encapsulate each circuit. The barrier can be formed as a compartmentalized dam having a separate cavity for each circuit, as a perimeter dam having a single cavity, or as a spacer sheet having a separate cavity for each circuit formed by a pattern of cut outs. Following the encapsulation step, the electrical circuits can be singulated into separate encapsulated circuits.

Substrate assembly including a compartmental dam for use in the

A method for encapsulating an electronic component includes providing a substrate; providing an enclosure dam around at least a portion of electronic component placed relative to the substrate; providing a first substantially uncured flowable encapsulation material outwardly of the electronic component and within the enclosure dam; providing a second encapsulation material atop the first encapsulation material and within the enclosure dam; and curing the first encapsulation material into a substantially non-flowable state, the second encapsulation material and the enclosure dam retaining the first flowable encapsulation material relative to the electronic component and substrate during the curing, the cured first material and the second material collectively forming a resultant encapsulation body on the electronic component. An encapsulated body having the above attributes is also disclosed.

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Boise, ID, United States of America

Clay L Cirino