Qualcomm Incorporated

Epcos Ag

Snaptrack Incorporated

Claus Reitlinger

Anna Katharina Krefft

Andreas Franz

Karl Weidner

Jürgen Portmann

Gerhard Zeller

Oliver Freudenberg

Stefan Kiefl

Alberto Jose Teixeira De Queiros

Frank Rehme

Rudolf Bart

A package that includes a substrate, an integrated device, a first encapsulation layer and a void. The substrate includes a first surface. The integrated device is coupled to the first surface of the substrate. The first encapsulation layer is located over the first surface of the substrate and the integrated device. The first encapsulation layer includes an undercut relative to a side surface of the integrated device. The void is located between the integrated device and the first surface of the substrate. The void is laterally surrounded by the undercut of the encapsulation layer.

Package comprising a substrate, an integrated device, and an encapsulation layer with undercut

The present invention relates to a module that has a lower component of a module () having a material () in which at least one first structural element () is embedded, and an upper component of a module () having a material () in which at least a second component () is embedded. The upper component of the module () and the lower component of the module () are stacked, with the lower and the upper component of the module () being electrically connected and mechanically linked to each other. In addition, the present invention relates to a simple and cost-effective process for the production of a variety of modules. The invention makes it possible for the modules to be miniaturized with respect to surface and height and/or makes it possible to achieve greater integration by 3D packaging.

Stacked modules

Some features pertain to a package that includes an enhanced electromagnetic shield. The package includes a substrate, an electronic component coupled to the substrate, and a mold partially surrounding the electronic component. The package further includes a first shield over the mold, and a second shield over the first shield. One of the first shield or the second shield is a high permeability shield and the remaining first or second shield is a high conductivity shield relative to the high permeability shield.

Integrated circuit package comprising an enhanced electromagnetic shield

The invention relates to a module package which comprises a module substrate, a chipapplied using the flip chip process, and an encapsulation layer, and to a method for producing same. The chiphas component structures on the top sidethereof. Said top saidfaces the module carrier, wherein a gapis formed between the top sideof the chip and the module carrier. A filler is added to the encapsulation layer. The encapsulation layerpartly fills underneath the chip, wherein at most the part of the chip, on which no component structures are present, is underfilled, and at a minimum the material of the encapsulation layercompletely encloses the sides of the chip

Module package and production method

An electronic device comprises a substrate (), at least one electronic component () arranged on the substrate, and an encapsulation () covering the at least one electronic component (). An electromagnetic protective layer () covers a surface () of the encapsulation () that faces away from the substrate (), and the side faces () directed transversely with respect to the surface (). In particular, a thermal and/or electrical coupling () couples the electromagnetic protective layer () thermally and/or electrically to a region () of the electronic device () that is enclosed by the encapsulation. For production purposes, the device is singulated from a panel and the electromagnetic protective layer () is subsequently applied.

Growing community of inventors

Wolnzach, Germany

Claus Reitlinger