Suss Microtec Test Systems Gmbh

Cascade Microtech, Inc.

Karl Suss Dresden Gmbh

Other

Suss Microtec Tech Systems Gmbh

Claus Dietrich

Stefan Schneidewind

Stojan Kanev

Jorg Kiesewetter

Michael Teich

Stefan Kreissig

Dietmar Runge

Frank Fehrmann

Frank-Michael Werner

Jörg Kiesewetter

Botho Hirschfeld

Karsten Stoll

Axel Schmidt

Sebastian Giessmann

Matthias Zieger

Don Feuerstein

Denis Place

Jens Fiedler

Carel Van De Beek

Volker Hansel

Mike Lancaster

Hans-Jürgen Fleischer

Alf Wachtveitl

Thomas Huelsmann

Reinhard Welsch

Thomas Tharigen

The invention generally relates to a method and device for contacting contact areas () with probe tips () in a tester. The contact areas (), which are arranged on a substrate (), and the probe tips () are positioned relative to each other and then brought in contact with each other by an advancing motion. In order to detect a secure contact for each of the probe tips (), the contacting between the probe tips () and the contact areas () is observed from at least two observation directions (), which include an observation angle &#x3b1; in a range of 0 to 180&#xb0;.

Method and device for contacting a row of contact areas with probe tips

The invention relates to a method for testing several electronic components () of a repetitive pattern under defined thermal conditions in a prober, which comprises a chuck () for holding the components () and special holding devices () for holding individual probes (). For testing, the components () are adjusted to a defined temperature, the probes () and a first electronic component () are positioned relative to each other by means of at least one positioning device, contact pads () of the electronic component () are subsequently contacted by the probes () so that the component () can be tested and then the positioning and the contacting can be repeated for testing another component () of the repetitive pattern. In order to shorten the test time for measurements at changing temperatures while ensuring reliable contacting of the components by using individual probes, a component () is positioned and contacted by a first positioning step which jointly affects all probes () first being carried out in an intermediate position, in the result of which the component () lies at a defined distance under the probe tips (), the position of each individual probe tip () being subsequently corrected by means of separate manipulators to the position of the corresponding contact pad () to be contacted with the particular probe tip () so that each probe tip () lies above a contact pad (), and the probe tips () further subsequently being brought into contact with the contact pads () of the component () by means of an advancing movement.

Method for testing electronic components of a repetitive pattern under defined thermal conditions

A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method. The relative displacement determined at the second instant is used to correct the positioning of the first and second objects as necessary to maintain a desired position of the two objects.

Method for increasing the accuracy of the positioning of a first object relative to a second object

A probe holder in which the probe needle has a slight horizontal offset under the action of a vertical force comprises a probe holder for a probe needle, wherein the holder is adapted, for fastening and electrical contact-connection, on a carrier device of a test apparatus and has a holder arm having a needle holder at the free end thereof to fasten the probe needle, and a fastening arm for connecting the holder arm to the carrier device. The holder arm and fastening arm are connected to one another by a parallel guide whereby horizontal offset of the needle tip on account of external forces can be reduced or even prevented making it easier for the probe needle to carry out a vertical yielding movement, with almost no rotation of the probe needle about a horizontal axis.

Probe holder for a probe for testing semiconductor components

In a method and an apparatus for measuring temperature-controlled electronic components in a test station, a component to be measured is held and positioned using a chuck, has a temperature-controlled and directed fluid flow applied to it and is electrically contact-connected using probes and is measured. The setting of the temperature of the component to the temperature at which the measurement is intended to be carried out is effected solely using a directed fluid flow at a defined temperature.

Method and apparatus for controlling the temperature of electronic components

A prober is described that is suitable for testing of semiconductor substrates under atmospheric conditions that deviate from ambient conditions. The prober includes a chuck for mounting of a semiconductor substrate and a probe holder for mounting of test tips for electrical contacting of the semiconductor substrate. The semiconductor substrate and test tips are arranged within a housing sealed relative to the surrounding atmosphere. The housing comprises two housing parts joined with a seal. The seal can be inflated with two different pressures and is less deformable at higher pressure. For testing of the semiconductor substrate, coarse positioning of the semiconductor substrate relative to the test tips occurs under atmospheric conditions and then fine positioning with the sealed housing and deformable seal before the lower deformability of the seal is produced at higher pressure in the seal and the semiconductor substrate is contacted by the test tips and tested.

Probe station and method for measurements of semiconductor devices under defined atmosphere

An apparatus for testing substrates reduces the area required and the costs which arise with the testing of substrates, in particular semiconductor wafers, during the production process. The apparatus includes testing arrangements comprising a chuck, a chuck drive, control electronics, probe or probe board holding means with a handling system, a substrate magazine station and an alignment station. The testing arrangements include at least two testing arrangements, both of which are all jointly operatively connected to the handling system, the substrate magazine station and the alignment station.

Apparatus for testing substrates

A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established. The object is achieved by the vertical movement of the semiconductor wafer until the end position is reached being directly observed in a horizontal direction of observation and, for this purpose, an observation device is arranged in such a way that the observation axis runs in the spacing above the free wafer surface.

Method and prober for contacting a contact area with a contact tip

A test apparatuss for testing substrates at low temperatures has a chuck, which can be displaced in the working area by means of a chuck drive, the temperature of which can be controlled using heating and cooling means. The chuck has a receiving surface for receiving a test substrate and holding means for fixing a substrate carrier which receives the test substrate. Spatially and thermally defined test conditions are maintained with minimal energy and labor costs both at room temperatures and at low temperatures. This is achieved by providing a vacuum chamber which surrounds the working area of the chuck. The chuck is on one side thermally decoupled from the uncooled chuck drive and on the other side is thermally connected in a releasable manner to the test substrate. The cooled chuck and the cooled test substrate are shielded from the thermal radiation of the surrounding uncooled assemblies by means of a directly cooled thermal radiation shield.

Test apparatus for testing substrates at low temperatures

The invention, which relates to a test apparatus with loading device which has a chuck, which is provided with a bearing surface for a test substrate and with a chuck drive, by means of which the chuck can be displaced with a working area, and which has a receiving means for receiving test substrates, which can be displaced from a working area of the chuck to a receiving position outside the working area, is based on the object of increasing the accuracy of the movement of the chuck. Moreover, in the case of test apparatus with a controlled atmosphere, a further object is to prevent the chuck from being exposed to the open-air atmosphere. This is achieved by virtue of the fact that a carriage, which can be displaced between a position close to the chuck, in which the chuck is located in a position inside the working area, and the receiving position, is provided, which carriage is provided with a holder, in which the test substrate can be at least indirectly inserted in such a way that the test substrate, when the carriage is in the position close to the chuck, is located above the chuck. The holder and the chuck can move vertically relative to one another when the carriage is in the position close to the chuck.

Test apparatus with loading device

A substrate-holding device is designed as a one-piece ceramic element having a number of variably heavily doped layer regions. At least one layer region is a conductive region and at least one layer region is an insulative region. A multilayer chuck structure is thereby formed which does not exhibit mechanical surface interfaces between the layers.

Substrate-holding device for testing circuit arrangements on substrates

The invention relates to a tester for pressure sensors in the wafer compound or isolated pressure sensors having a recess for the pressure sensors as well as means for electrical contacting of the electrical connections of at least one of the pressure sensors. The invention is intended to make it possible to test pressure sensors still in a wafer compound for their function. According to the invention, a pressure head is provided which has an interior space open on one side, the open face of which is capable of being mounted on the pressure sensor in such a way that the interior space is tightly sealed by the latter. In this way a static or dynamic pressure of specified amount and duration can be exerted on the sensor element at least so that the sensor element is moved out of its resting position. At the same time, the electrical connections of the selected pressure sensor are connected with an electrical evaluation unit.

Tester for pressure sensors

The present invention provides an apparatus for the testing of semiconductor structures. The apparatus is provided with a chuck for holding a semiconductor wafer and with needle holders for contact needles, the chuck being provided with a fastening device for the semiconductor wafer and being movable for positioning, controlled using a positioning device, in relation to the contact needles. The object of the present invention is to detect faults, in good time and reliably, of non-serviceable or not fully serviceable chips before separation to avoid unnecessary work for separating and assembling defective chips. The object is attained in that the chuck has a receiving area exposing upwards a lower surface of the semiconductor wafer and a receiving plane therefor. The receiving plane is arranged above the needle carrier, and the contact needles point upwards in such a manner that they contact contact islands of the semiconductor chips on the downwardly directed upper surface of the semiconductor wafer.

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Sacka, Germany

Claus Dietrich