International Business Machines Corporation

Claudius Feger

Gareth Geoffrey Hougham

Jane M Shaw

Stephen L Buchwalter

Mathias B Steiner

Jae-Woong Nah

Nancy C LaBianca

John Ulrich Knickerbocker

Peter Alfred Gruber

Jeffrey Donald Gelorme

Emmanuel Delamarche

Jaione Tirapu Azpiroz

Yuksel Temiz

Maurice McGlashan-Powell

Ronaldo Giro

Mark Harrison McLeod

Marie Angelopoulos

Sung Kwon Kang

Ho-Ming Tong

Michael J Palmer

Vincenzo Condorelli

Alphonso Philip Lanzetta

Teresita Ordonez Graham

Kurt R Grebe

Linda C Matthew

Charles H Wilson

Helen L Yeh

John J Liutkus

Ijeoma M Nnebe

Nelson R Tanner

Voya Rista Markovich

Ali Afzali-Ardakani

Paul Andrew Moskowitz

Alejandro Gabriel Schrott

Edmund Juris Sprogis

Hosadurga K Shobha

Da-Yuan Shih

Konstantinos I Papathomas

Robert J Von Gutfeld

Jon Alfred Casey

Donald Seton Farquhar

Jeffrey Curtis Hedrick

Charles Philippe Tresser

Phaedon Avouris

Eric D Perfecto

Mark David Poliks

Stephan Alan Cohen

Michael Engel

John Patrick Hummel

Ricardo Luis Ohta

Nihad Hadzic

Marco Martens

Leena Paivikki Buchwalter

Steve Harris Weingart

Matteo Flotta

Kevin C Gotze

Kathleen Conlon Hinge

Anurag Jain

George Szeparowycz

Rodrigo Ferreira

Michael A Gaynes

Paul Alfred Lauro

Stefano Sergio Oggioni

Brian Samuel Beaman

Fuad Elias Doany

Lior Horesh

Chandrasekhar Narayan

Thomas Mario Cipolla

Sushumna Iruvanti

Robert L Sandstrom

David Hirsch Danovitch

Rajneesh Kumar

Peter Slota, Jr

Steven Erik Steen

Ali Afzali-ardakani

John J Ritsko

Ulisses Mello

Revathi Iyengar

Soojae Park

Steven E Molis

Randy William Snyder

Walter P Pawlowski

John J Glenning

Philip C D Hobbs

Jae-woong Nah

Steven L Bard

Bonnie L Glick

Jeffrey D Gelmore

Philip O D Hobbs

Maria J B Moura

An assembly is provided for interfacing with a microfluidic chip having at least one microscopic channel configured to receive a liquid sample for analysis. The assembly includes a chip carrier, an electronics module, an optical module, and a mechanical module. The chip carrier includes a base and a cover defining a cavity to receive the microfluidic chip. The electronics module includes a signal generator which applies at least one electrokinetic signal electrode(s) of the chip. The optical module includes an excitation radiation source which causes excitation radiation to impinge on the sample, and an emission radiation detector which detects radiation emitted from the sample. The mechanical module includes a chip-carrier receiving structure, relatable with respect to the optical module for focus and at least one degree of translational freedom.

Operation of diagnostic devices involving microchannels and electrodes

A method of designing a nanoparticle tailored to support hydrocarbon recovery in a subterranean formation, a method for using nanoparticles to extract hydrocarbon from a subterranean formation, and a nanoparticle structure. The method may include determining environmental conditions of a subterranean formation, defining nanoparticle parameters based on the environmental conditions, and forming a nanoparticle comprising the nanoparticle parameters. The method may include producing a colloidal suspension of nanoparticles by mixing nanoparticles with water and injecting the colloidal suspension of nanoparticles into a subterranean formation. A nanoparticle structure may include a hydrophilic material in a defined three-dimensional shape having a maximum diameter. The nanoparticle may penetrate through an oil-water interface with an optimized contact angle, minimize an interfacial area between oil and water, and create an oil in water emulsion.

Nanoparticle design for enhanced oil recovery

An injection-molded solder (IMS) tool assembly apparatus, the apparatus including an IMS tool for dispensing a molten material via a round extrusion part to coat an inside or an outside wall of a pipe (and a chiller for providing cooling water to flow through an inside of the pipe.)

Injection-molded solder (IMS) tool assembly and method of use thereof

Conventional computational simulation and inversion of subsurface flow is expensive, which is wasteful in terms of time and energy consumption. The present invention discloses a process for implementation of mathematical techniques such as forward simulation, sensitivity analysis, and inversion to physical microstructure models for subsurface fluid simulation. This process not only offers accurate and reliable results, but also is cost effective.

Tunable miniaturized physical subsurface model for simulation and inversion

A device for trapping at least one microparticle in a fluid flow is suggested. The device comprises a trapping element and an electrode. The trapping element is configured for trapping the at least one microparticle and has at least one recess for receiving the at least one microparticle. The electrode is configured for generating an asymmetric electric field. In operation, at least one microparticle of a plurality of microparticles passing through the asymmetric electric field is forced into the at least one recess of the trapping element.

Trapping at least one microparticle

A microchannel for processing microparticles in a fluid flow comprises a first and second pairs of electrodes. The first pair of electrodes is configured for generating an asymmetric first electric field and for sorting the microparticles to provide sorted microparticles. The second pair of electrodes is configured for generating an asymmetric second electric field and for trapping at least some of the sorted microparticles.

Microchannel, microfluidic chip and method for processing microparticles in a fluid flow

An Integrated Circuit (IC) chip with a lab-on-a-chip, a method of manufacturing the lab-on-a-chip and a method of using the lab-on-a-chip for fluid flow analysis in physical systems through combination with computer modeling. The lab-on-a-chip includes cavities in a channel layer and a capping layer, preferably transparent, covering the cavities. Gates control two dimensional (2D) lattice structures acting as heaters, light sources and/or sensors in the cavities, or fluid channels. The gates and two dimensional (2D) lattice structures may be at the cavity bottoms or on the capping layer. Wiring connects the gates and the 2D lattice structures externally.

Method and integrated device for analyzing liquid flow and liquid-solid interface interaction

A preassembly semiconductor device comprises substrate soldering structures extending toward chip soldering structures for forming solder connections with the chip soldering structures, i.e., the chip and the substrate are in preassembly positions relative to one another. The height of the substrate soldering structures is greater than the height of the chip soldering structures. A pre-applied underfill is contiguous with the substrate and is sufficiently thick so as to extend substantially no further than the full height of the substrate soldering structures. In another embodiment the height of the chip soldering structures is greater than the height of the substrate soldering structures and the pre-applied underfill is contiguous with the semiconductor chip and sufficiently thick so as to extend substantially no further than the full height of the chip soldering structures. A process comprises manufacturing semiconductor assemblies from these devices by soldering the semiconductor chip and the substrate to one another.

No flow underfill or wafer level underfill and solder columns

An arrangement for the protection of cryptographic keys and codes from being compromised by external tampering, wherein the arrangement is utilized within a multilayered securing structure. More particularly, there is provided a multilayered securing structure for the protection of cryptographic keys and codes, which may be subject to potential tampering when employed in computers and/or telecommunication systems. A method is provided for producing such multilayered securing structures within a modular substrate with the intent to protect cryptographic keys and codes which are employed in computers and/or telecommunication systems from the dangers of potential tampering or unauthorized access.

Multilayer securing structure and method thereof for the protection of cryptographic keys and code

A process and tools for forming spherical metal balls is described incorporating molds, injection molded solder, a liquid or gaseous environment to reduce or remove metal oxides and an unconstrained reflow of metal in a heated liquid or gas and solidification of molten metal in a cooler liquid or gas.

Forming constant diameter spherical metal balls

Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head.

Injection molded solder process for forming solder bumps on substrates

A method of manufacturing a thermal paste, in which the method includes feeding the thermal paste into a chamber of an extruder; mixing the thermal paste at elevated temperatures; de-airing the thermal paste; and extruding the thermal paste out of the chamber through a die as a pre-form or into a cartridge, such that air channels and pseudo-grain boundaries are prevented from forming in the thermal paste.

Vacuum extrusion method of manufacturing a thermal paste

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Poughkeepsie, NY, United States of America

Claudius Feger