Motorola Corporation

Lifescan Corporation

Motorolr, Inc.

Claudia Gamboa

Gregory Joseph Dunn

Manes Eliacin

Timothy B Dean

Marc Kenneth Chason

Anthony J Polak

Allyson J Beuhler

Ke Keryn Lian

Jovica Savic

Robert H Terbrueggen

Robert T Croswell

Shawn O'Rourke

Daniel J Sadler

Keryn Lian

Remy J Chelini

Ralph Ballerstadt

Remy J Chilini

The present invention provides a device and methods for detecting the presence of an analyte in a sample using an encapsulated sensor. Methods for manufacturing the sensor are also disclosed.

Sensor device and methods for manufacture

A dielectric circuit board foil () includes a conductive metal foil layer (), a crystallized dielectric oxide layer () disposed adjacent a first surface of the conductive metal foil layer, a lanthanum nickelate layer () disposed on the crystallized dielectric oxide layer, and an electrode layer () that is substantially made of one or more base metals disposed on the lanthanum nickelate layer. The foil () may be adhered to a printed circuit board sub-structure () and used to economically fabricate a plurality of embedded capacitors, including isolated capacitors of large capacitive density (&#x3e;1000 pf/mm).

Printed circuit dielectric foil and embedded capacitors

Circuit boards () and methods for fabricating circuit boards that include conduits () are provided. The conduits formed by patterning a metal layer () are lined by inert coating () and caped by a photodefinable polymer layer () that is affixed to the inert coating by with the help of an initially uncured polymer layer (). Holes are formed by patterning the photodefinable polymer layer for admitting and removing fluid from the conduit.

Conduits integrated in circuit board and method of manufacture

In one embodiment, a peelable circuit board foil () has a metal support layer () and a conductive metal foil layer () bonded by an inorganic release material (). The conductive metal foil layer has a an exposed surface () that is coated with a high temperature anti-oxidant barrier () and has a roughness less than 0.05 microns RMS. In a second embodiment, the peelable printed circuit foil () has a crystallized dielectric oxide layer () disposed on the exposed surface of the conductive metal foil layer and an electrode layer () disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil () that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.

Peelable circuit board foil

Circuit boards ( ) and methods for fabricating circuit boards that include heaters for maintaining temperature sensitive components at an operating temperature are provided. Resistive traces ( ) are included in the circuit boards proximate temperature sensitive apparatus ( ). Thermally conductive patches ( ) are interposed between the resistive traces and the temperature sensitive components. The thermally conductive patches establish zones of relatively uniform temperatures. According to a preferred embodiment of the invention the temperature sensitive apparatus comprises a fluid conduit ( ).

Heater for temperature control integrated in circuit board and method of manufacture

Growing community of inventors

Chicago, IL, United States of America

Claudia Gamboa