Lumentum Operations LLC

Ciena Corporation

Bookham Technology Limited

Claude Gamache

Michael Ayliffe

Antoine Bois

Marie-Josee Picard

Yuliya Akulova

François Pelletier

Charles Baudot

Simon Savard

Rad Sommer

Adonios Bitzanis

Jill Oosterom

Scott Cameron

Nicolas Belanger

A gain medium is pumped by a source. An optical wave passes through a photonic integrated circuit (PIC) that comprises: a substrate comprising silicon, multiple photonic structures, an input port coupling an optical wave into a waveguide formed in the PIC, and an output port coupling an optical wave out of a waveguide formed in the PIC. Propagation of an optical wave circulating around a closed path of a laser ring cavity is limited using an optical isolator such that, when the pump source exceeds a lasing threshold, the optical wave propagates in a single direction through the gain medium and PIC. From an output coupler, an output is provided that comprises a fraction (e.g., &#x3e;0.5) of the power of an optical wave that is incident upon the output coupler, and remaining power of the optical wave is redirected around the closed path of the laser ring cavity.

Managing optical power in a laser

A gain medium is pumped by a source. An optical wave passes through a photonic integrated circuit (PIC) that comprises: a substrate comprising Silicon, a plurality of photonic structures, an input port coupling an optical wave into a waveguide formed in the PIC, and an output port coupling an optical wave out of a waveguide formed in the PIC. Propagation of an optical wave circulating around a closed path of a laser ring cavity is limited using an optical isolator such that, when the pump source exceeds a lasing threshold, the optical wave propagates in a single direction through the gain medium and the PIC. From output coupler, an output that is provided that comprises a fraction of the power of an optical wave that is incident upon the output coupler, and remaining power of the optical wave is redirected around the closed path of the laser ring cavity. The fraction can be greater than 0.5.

At least a portion of an integrated circuit wafer includes at least one layer in which two or more waveguides are formed. A cavity is formed in the integrated circuit wafer. At least one die, comprising a photonic integrated circuit, has: at least one edge on which there are two or more optical mode defining structures in proximity to respective optical mode defining structures on at least one surface of the cavity, a bottom surface secured to a bottom surface of the cavity, and a top surface on which there is at least one metal contact.

Companion and host chip photonic integration

An optical device may include a semiconductor laser chip to independently generate four laser beams at different wavelengths. Each laser beam, of the four laser beams, may be directed to a respective optical output of the optical device with a sub-micron level of tolerance of each laser beam relative to the respective optical outputs of the optical device, and each laser beam, of the four laser beams, may be associated with a different optical path from the semiconductor laser chip to the respective optical output of the optical device. The optical device may include a lens to receive each of the four laser beams. The lens may be positioned to direct each laser beam, of the four laser beams, toward the respective optical output of the optical device. The optical device may include an optical isolator to receive each of the four laser beams.

Multi-laser package using shared optics

The invention relates to an optical transmitter assembly (OTA) for vertical coupling of light into a chip, and to a method for manufacturing the OTA. The OTA includes a laser diode, a microlens and a turning mirror mounted at a top face of a supporting substrate within a sealed enclosure, and an optical component, such as an optical isolator, a polarizer, or a microlens disposed in a substrate cavity that opens to the back face of the substrate. The optical component may be placed into the cavity after the enclosure is sealed.

Optical transmitter assembly for vertical coupling

An optomechanical assembly for a photonic chip is disclosed. The optomechanical assembly may include a planar lightwave circuit optically coupled to a plurality of vertical coupling gratings on the photonic chip, to couple light between an optical connector abutting the planar lightwave circuit and the photonic chip.

Optomechanical assembly for a photonic chip

A micro-optic dual beam-splitter assembly comprises at least two beam-splitter optical filters and at least one photoreceptor. Each of the beam-splitter optical filters comprises an optical substrate having at least a coated or uncoated optical tap surface and a filter surface carrying a thin-film optical filter. The thin-film optical filters are substantially normal to the optical path from an optical signal source. Each of the optical tap surfaces is operative as an optical beam splitter to tap off an optical tap signal. The one or more photoreceptors are arranged to receive both or at least one of the optical tap signals. The tap signals comprise a portion of the optical signals passed along the optical path to the optical filter chips. The filter chips are cooperatively transmissive to an optical signal output port of a selected set of wavelengths received from the optical signal source along the optical path, and are reflective of other wavelengths. Each of the one or more photoreceptors are operative to pass tap signals to a corresponding tap signal output port, either as optical or electrical signals. Various different embodiments of the disclosed micro-optic dual beam-splitter assemblies are useful as TOSAs, ROSAs, gain-flattening filters for optical amplifiers, or other applications.

Growing community of inventors

Gatineau, Canada

Claude Gamache