Alcatel

Thales

Alcatel Alsthom Compagnie Generale D'electricite

Alcatel Espace

Claude Drevon

Hervé Legay

Olivier Vendier

St&eacute;phane Albinet

Norbert Venet

David Nevo

Walim Ben Naceur

Philippe Monfraix

Mathieu Paillard

Jean-Jacques Belin

Chloé Schaffauser

Barbara Bonnet

Walim Thales Alenia Space Ben Naceur

A method is provided for the sealed assembly of an electronic housing containing one or more electronic components. The method includes: assembling the housing by bringing a support, to which the electronic components are fixed, in contact with a cover by means of a mixture-including a paste and nanoparticles in suspension in the paste. The size of the nanoparticles range from 10 to 30 nm. The housing is closed in a sealed manner by heating the housing to a temperature T of between 150&#xb0; C. and 180&#xb0; C. making it possible to sinter the metal nanoparticles, while subjecting the housing to a pressure greater than 2.5&#xd7;10Pa.

Method for the sealed assembly of an electronic housing

A hybrid microwave circuit device comprises a base provided with an external peripheral wall and at least one internal wall together delimiting at least two cavities to accommodate hybrid microwave circuits and a cover which is made of the same material as the base. The cover has an internal face fastened to the edge of the peripheral wall to provide a hermetic seal of the cavity and to establish an electrical contact with the peripheral wall. The cover comprises deformable and elastic contact members fastened to its internal face and adapted to establish an electrical contact with the edge of the internal wall.

Device with hybrid microwave circuits shielded by elastic contact members

A method of obtaining a module including at least one inductive winding made up of one or more conductive tracks on a printed circuit film support on which the tracks form turns which are combined to form a winding or a plurality of parallel and/or coaxial windings. The method includes the steps of: stacking a plurality of aligned modular printed circuit film elements carrying a set of turns which are intended to form part of a winding or of a plurality of parallel and/or coaxial windings and whose tracks terminate at or near the edge or one edge of the element that includes them, molding an insulative material over the stacked assembly of modular elements to constitute a rigid block, cutting the molded block laterally along the stack to expose the conductive tracks at a common alignment level and so that they are flush with the surface of one face of the block, which cutting step is performed at least once, and creating connections on the face or faces of the block with which the modular conductive track elements are flush to interconnect them selectively and to connect them to connection means external to the module.

Method of obtaining a module including an inductive winding

A monoblock structure comprises at least two stacked component levels, each component level comprising a layer of insulative material forming a component and encapsulation storey, at least one component and at least a first track a first end of which is connected to a connection point of the component. The structure further comprises at least one second track disposed laterally and a first end of which is connected to a second end of the first track. It additionally comprises a printed circuit forming a printed circuit storey and supporting at least one third track. A first end of the third track is coupled to a single input and/or output member one end of which is exposed on a face of the structure parallel to the component and printed circuit storeys and a second end of the third track is connected to a second end of the second track.

Monoblock structure for stacked components

A device having radiating elements includes a support structure defining a plurality of unit cells, at least one electronic circuit, connection for supplying at least one input signal to the electronic circuit and at least one radiating element connected to an output of the electronic circuit in order to radiate in response to reception of a signal produced at the output of the electronic circuit. The electronic circuit is encapsulated in a dielectric module to form a microwave electronic module comprising a plurality of unit structures stacked to form a block, each structure comprising a bottom dielectric layer on the top surface of which is disposed an integrated circuit. The radiating element is disposed directly on a first face of the module.

Device with radiating elements

An assembly of electronic modules comprises electronic modules supported by a support structure. Each electronic module is in the form of electronic components stacked on at least two levels which are separated by an intermediate layer. Each electronic module comprises at least one hole formed in the intermediate layer. The support structure comprises at least one rod element that is introduced into respective holes of successive modules.

Growing community of inventors

Toulouse, France

Claude Drevon