Hutchinson Technology Corporation

Mound Laser & Photonics Center, Inc.

Clark T Olsen

Michael Wayne Davis

Douglas P Riemer

Peter Francis Ladwig

Dean E Myers

Matthew S Lang

Paul Valentine Pesavento

Steven R Lagergren

Jeffery G Ribar

Jacob D Bjorstrom

Zachary A Pokornowski

Duane M Jelkin

Scott J Cray

Erich W Bierbrauer

Beauregard J Gagnon

A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.

Miniature pressure/force sensor with integrated leads

A method for producing a component without tabs during etching. The method includes: applying a wafer tape to the plated side of the substrate; depositing a resist layer on a metal layer on a metal side of the substrate that is opposite of the plated side; exposing the resist layer to UV light; developing the resist layer; and etching the metal layer.

Method for forming components without adding tabs during etching

An apparatus is described. The apparatus may include a substrate and one or more sensors mounted to the substrate. The one or more sensors may be mounted to the substrate using adhesive material and one or more spot welds.

Integrated sensors

An identification device includes a first metal layer patterned into a planar coil winding and a second metal layer electrically connected to the first metal layer. The first metal layer is operable to provide a circuit inductance. The second metal layer is patterned to provide one or more overlapping areas with the first metal layer. The second metal layer is operable to provide a circuit capacitance. The identification device includes a dielectric layer separating the first metal layer and the second metal layer.

Component identification

An apparatus is described. The apparatus includes a substrate and one or more sensor components formed on the substrate. And, the apparatus includes one or more electrical circuits formed on the substrate electrically coupled with at least one of the one or more sensor components formed on the substrate.

Apparatus and method for forming sensors with integrated electrical circuits on a substrate

A method of making a component includes applying a clamping force to the component, the component coupled to a carrier strip of a panel via a polymeric tab and separating a portion of the polymeric tab from a substrate of the component, thereby causing the component to be detached from the panel.

Removable tabs and methods of making and using the same

An apparatus and related methods are described. The apparatus is described that includes a structural metal element including a metallic foam layer. The apparatus also includes a second metal element and a nonmetallic spacer. The nonmetallic spacer arranged between the structural metal element and the second metal element, the metallic foam layer joined to the nonmetallic spacer.

Metallized components and surgical instruments

A surgical instrument and related methods are described. The surgical instrument includes a first jaw including a first structural jaw element and a first sealplate fixed to the first structural jaw element and a second jaw including a second structural jaw element and a second sealplate fixed to the second structural jaw element. The second structural jaw element is moveably coupled to the first structural jaw element to facilitate pinching tissue between the first and second sealplates. The first and second sealplates are configured to facilitate sealing tissue pinched therebetween. The first jaw further includes a metallized tie layer between the first sealplate and the first structural jaw element, wherein the first sealplate is fixed to the first structural jaw element via a metal to metal joint between the first sealplate and the metallized tie layer.

A method for forming rails on the beam region of a disk drive head suspension. Rails are formed on a first portion of the beam region while supporting the beam region at a first location. Rails are formed on a second portion of the beam region while supporting the beam region at a second location that is different than the first location.

Growing community of inventors

Dassel, MN, United States of America

Clark T Olsen