Te Connectivity Solutions Gmbh

Tyco Electronics Japan G.k.

Te Connectivity Services Gmbh

Clarence Leon Yu

Christopher William Blackburn

Nathan Lincoln Tracy

Michael David Herring

Jeffery Walter Mason

Chad William Morgan

Brian Patrick Costello

John Joseph Consoli

Shinichi Hashimoto

Hiroshi Shirai

Megan Hoarfrost Beers

Jennifer Love

An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.

Electronic assembly including cable modules

A socket assembly includes an electrical interconnect having an insulator having apertures. The electrical interconnect includes primary contacts and secondary contacts received in corresponding apertures. The primary contacts include a primary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting first and second electronic packages. The secondary contacts include a secondary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting the first and second electronic packages. The contact tips of the secondary conductive polymer columns have a different shape from the shape of the contact tips of the primary conductive polymer columns.

Electrical interconnect with conductive polymer contacts having tips with different shapes and sizes

An electronic assembly includes an electronic package including a package substrate and an integrated circuit component mounted to an upper surface. The electronic package includes upper package contacts electrically connected to the integrated circuit component. The electronic assembly includes an interposer assembly including an array of compressible interposer contacts each having upper and lower mating interfaces. The interposer assembly defining a separable interface. The electronic assembly includes optical modules coupled to the separable interface of the interposer assembly and having an optical module substrate having module contacts and an optical engine mounted to the optical module substrate electrically connected to the module contacts. The optical module is mounted to the interposer assembly such that the module contacts are electrically connected to the upper mating interfaces of the interposer contacts. Each optical module includes at least one optical fiber terminated to the optical engine.

Electronic assembly including optical modules

A pluggable module includes a pluggable body extending between a cable end and a mating end rearward of the cable end. The pluggable body has a module cavity. The pluggable module includes a module circuit board received in the module cavity. The module circuit board has a mating edge at a mating end configured to be plugged into a first slot of a communication connector. The pluggable module includes a plug connector extending between a plug mating end and a plug mounting end. The plug mounting end is mounted to the module circuit board. The plug connector includes plug contacts extending between the plug mating end and the plug mounting end. The plug mating end is configured to be plugged into a second slot of the communication connector to mate the plug contacts with the communication connector.

High density communication system

Growing community of inventors

Sacramento, CA, United States of America

Clarence Leon Yu