Vermon S.a.

Université Grenoble Alpes

Cairdac

Claire Bantignies

Guillaume Férin

An Nguyen-Dinh

Hung Le Khanh

Skandar Basrour

Cyril Meynier

Etienne Flesch

Bogdan Rosinski

Guillaume Ferin

Emilie Trioux

Libor Rufer

Guillaume FÉRIN

Guilaume Ferin

A method of manufacturing a panel transducer scale package includes securing acoustic components at predetermined locations on a first carrier substrate with a first surface of the acoustic components positioned adjacent to the first carrier substrate. ASIC components are also secured at predetermined locations on the first carrier substrate with a first surface of the ASIC components positioned adjacent to the first carrier substrate. Photoresist resin is applied over the acoustic components and the ASIC components such that a second surface of the acoustic components is left exposed from the photoresist resin. The first carrier substrate is removed to expose the first surface of the acoustic components and the first surface of the ASIC components. A buildup layer is formed including electrical pathways between each of the acoustic components and the ASIC components, and the photoresist resin is removed.

Panel transducer scale package and method of manufacturing the same

A piezoelectric bimorph cantilever beam system includes a shim having a first main surface, a second main surface opposite the first main surface, a proximal end connected to an anchor, and a distal end opposite the proximal end. The system further includes a first piezoelectric layer laminated on the first main surface of the shim and a second piezoelectric layer laminated on the second main surface of the shim. A first beam stiffener is provided over the first main surface of the shim adjacent to the anchor with the first beam stiffener at least partially covering the first piezoelectric layer. A second beam stiffener is provided over the second main surface of the shim adjacent to the anchor with the second beam stiffener at least partially covering the second piezoelectric layer.

Piezoelectric energy harvesting bending structure and the method of manufacturing thereof

A vibrational multi-morph piezoelectric energy harvester includes a composite shim having a parallelepiped form with a thickness dimension made smaller than width and length dimensions, and having a stiffness shifting from one extremity to the other extremity to minimize mechanical constraints developed at a clamping area; a seismic mass mounted at an end opposite to the clamping area to mechanically match the system to the surrounding vibration resonance; one or more piezoelectric layers laminated on said composite shim; and electrodes plated onto the one or more piezoelectric layers for connection to an electronic harvesting circuit, a battery, or a super capacitor.

Piezoelectric energy harvester system with composite shim

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Tours, France

Claire Bantignies