Industrial Technology Research Institute

Cing-Jiuh Kang

Chin-Lang Wu

Chih-Hsiang Lin

Hsin-Ching Kao

Shu-Ling Yeh

Ya-Lan Chuang

Pei-Jung Tsat

Jen-Chun Chiu

Yu-Chuan Hsu

Chung-Cheng Lin

Chun-Hsiung Liao

Disclosed is a thermoplastic polyester elastomer, which is formed by reacting 100 parts by weight of polyester and 0.01 to 2 parts by weight of an epoxy resin with two epoxy groups, wherein the polyester is formed by reacting a parts by mole of a hard-segment diol, b parts by mole of a soft-segment diol, and 1 part by mole of a diacid, wherein 1&#x2266;a&#x2266;3 and 0.005&#x2266;b&#x2266;1.5.

Thermoplastic polyester elastomer and method for manufacturing the same

A method for packaging a light emitting diode is provided. The steps comprise: providing a material; drying the material; feeding the material into a feeding inlet; and providing a mold with pre-embedded light diodes. The material enters the feeding inlet and is injected into the mold by pressing a screw, allowing the material to combine with the light emitting diode.

Method for packaging light emitting diode

The disclosed is a copolymer having a formula as: Ris a combination of naphthalene, phenylene, butyl, and hexyl. Ris a combination of ethylene, cyclohexlene, 2-methylpropyl, and neopentyl. n is a number of 1500 to 3000. The copolymer has a transparency greater than 80%, a thermal resistance greater than 100&#xb0; C., a moisture absorption less than 0.5 wt %, and yellowing under UV/climate resistance greater than 1000 hours.

Copolymer and method for manufacturing the same and packaging material utilizing the same

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Hsinchu, Taiwan

Cing-Jiuh Kang