International Business Machines Corporation

Cindy M Reidsema

Voya Rista Markovich

Christina Marie Boyko

Francis Joseph Downes, Jr

Richard W Carpenter

Joseph Gene Sabia

Joseph Edward Varsik

Oscar A Moreno

Francis J Bucek

Darleen Mayo

The present invention provides an improved circuit board for mounting integrated circuit chips and a technique for manufacturing the circuit board. The board permits direct chip attachment to the circuit board by providing the necessary geometry for the footprint pattern of the chip connections without the necessity of multi-level packaging using chip carriers. The circuit board includes a substrate with plated through holes, and a film of photoresist dielectric material disposed on the substrate. The dielectric material is photo patterned to form vias which are then filled with conductive material. Electrical connection pads are formed on the exposed surface of the film of dielectric material in the pattern of the chip footprint to be mounted thereon. The vias and plated through holes are arranged in groups and patterns which provide some direct connection between the pads and plated through holes, some pads wired to vias on the exposed surface of the film of dielectric material and some vias wired to plated through holes on the surface of the substrate.

Printed circuit board with aligned connections and method of making same

The total organic content (TOC) of an aqueous composition is reduced to 200 ppm or less by subjecting the composition to electrolysis whereby the pH of the composition at the start of the electrolysis is about 1.8 to about 7 to thereby electrolytically decompose organic materials contained in the aqueous composition.

Electrolytic process for reducing the organic content of an aqueous

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Apalachin, NY, United States of America

Cindy M Reidsema