Wuhan Neuracom Technology Development Co., Ltd.

Chunshui Wang

Chao Wang

Li Huang

Cheng Huang

Jianfei Gao

Guangyan Cai

Disclosed are a reverse soldering connection structure of a microneedle and a wiring and a preparation process thereof. The reverse soldering metal layer of the microneedle is prepared; the reverse soldering metal layer of the wiring is prepared; the reverse soldering metal layer of the microneedle is aligned with the reverse soldering metal layer of the wiring, and they will be pressed to achieve reverse soldering connection between the microneedle and the wiring.

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Wuhan, China

Chunshui Wang