Samsung Display Co., Ltd.

Chunghwan Lee

Hongro Lee

A laser annealing apparatus includes: a substrate supporting unit which supports a substrate; a laser beam irradiating unit which irradiates a line laser beam extending in a first direction to an amorphous silicon layer provided on the substrate on the substrate supporting unit; a substrate moving unit which moves the substrate supporting unit in a second direction crossing the first direction; and a first beam cutter and a second beam cutter, which are disposed between the substrate supporting unit and the laser beam irradiating unit, where the first and second beam cutters move to increase or decrease a shielded area of the substrate, which is an area of the substrate overlapping the first or second beam cutter and the line laser beam, to shield from at least a portion of the line laser beam irradiated to a portion of the substrate at an outer portion of the amorphous silicon layer.

Laser annealing apparatus and method of manufacturing display apparatus by using the same

A laser annealing apparatus includes a substrate supporter that receives a substrate having an amorphous silicon layer, a laser beam irradiation unit that irradiates a line laser beam onto the substrate disposed on the substrate supporter, and a substrate transport unit that moves the substrate supporter in the first direction and in a second direction crossing the first direction and rotates the substrate supporter within a first plane defined by the first direction and the second direction. The substrate transport unit rotates the substrate supporter by an angle &#x3b8; less than about 90 degrees within the first plane and moves the substrate supporter both in the first direction and in the second direction at substantially the same time. The laser beam irradiation unit irradiates the line laser beam multiple times onto the substrate disposed on the substrate supporter while the substrate transport unit moves the substrate supporter.

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Yongin-si, South Korea

Chunghwan Lee