Huawei Technologies Co., Limited

Chunghsuan Tsai

Nan Zhao

Shanghsuan Chiang

A chip package includes a substrate, a first die, a second die, and a beam structure. The first die and the second die are disposed on a side of the substrate and are electrically connected to the substrate. The beam structure is disposed between the first die and the second die. A first end of the beam structure is stacked with and fixedly connected to a part of the first die, a second end is stacked with and fixedly connected to a part of the second die, and the beam structure is insulated from and connected to the first die and the second die. A thermal expansion coefficient of the beam structure is less than a thermal expansion coefficient of the substrate.

Growing community of inventors

Shenzhen, China

Chunghsuan Tsai