Avago Technologies General IP (Singapore) Pte. Ltd.

Avago Technologies Fiber IP (Singapore) Pte. Ltd

Avago Technologies International Sales Pte. Limited

Agilent Technologies, Inc.

Chung-Yi Su

Tak Kai Wang

Tak Kui Wang

Bing Shao

Ye Chen

Ronald T Kaneshiro

Frank David Yashar

Rashit Nabiev

Ramana M V Murty

Craig T Cummings

Xiaozhong Wang

Paul Yu

Nicolas J Moll

Jesse Chin

Hans G Rohdin

Kit Cham

Chen Ji

Nick Jordache

Alain Zhi Shang

Arlene Sachiyo Wakita-Oyama

Christine Chen

A light-emitting device includes a substrate having a first surface and an opposing second surface, and an epitaxial structure having a first surface and an opposing second surface. The second surface of the epitaxial structure is positioned in proximity with the first surface of the substrate. The light-emitting device includes a first metal layer having a first surface and an opposing second surface. The light-emitting device further includes at least one light confinement structure configured to confine light produced within the epitaxial structure. The at least one light confinement structure provides a low-refraction index boundary that confines the light in a mesa structure that is at least partially surrounded by the at least one light confinement structure. The at least one light confinement structure can also be arranged to create separate confinement regions to serve as bandwidth enhancement coupled cavities for the active region of the light-emitting device.

Optical devices with bandwidth enhancing structures

Optical devices and systems are depicted and described herein. One example of the optical system is disclosed to include a semiconductor layer, a first metal strip positioned adjacent to a first surface of the semiconductor layer, a second metal strip positioned adjacent to a second surface of the semiconductor layer that opposes the first surface of the semiconductor layer, and a third metal strip positioned adjacent to the second surface of the semiconductor layer. In one example, the first metal strip includes a first aperture positioned adjacent to a first active region in the semiconductor layer and second aperture positioned adjacent to a second active region in the semiconductor layer. The second metal strip overlaps the first metal strip in proximity with the first active region and not the second active region and the third metal strip is oriented substantially parallel with the second metal strip.

Optical device and system having an array of addressable apertures

A passive alignment system is provided that comprises one or more first meltable elements disposed on a surface, one or more second meltable elements disposed on a surface and one or more first standoff devices. The first and second meltable elements transition from first and second pre-molten states, respectively, to first and second molten states, respectively, when subjected to first and second temperatures, respectively. In the first molten state, the first meltable elements control relative alignment between the surfaces in first and second dimensions. In the second molten state, the second meltable elements and the first standoff devices control relative alignment between the surfaces in a third dimension. The passive alignment system is suitable for use in a parallel optical communications module to precisely passively align ends of a plurality of optical fibers or waveguides with respective light sources or light detectors of the module.

Passive alignment system and an optical communications module that incorporates the passive alignment system

An optical chip-scale package (CSP) is provided for use in a high channel density, high data rate communications system that has optical I/O ports and that is capable of being housed in a standard rackmount-sized box. The optical I/O ports comprise a bulkhead of multi-optical fiber (MF) adapters installed in a front panel of a switch box that houses the communications system. The adapters have first and second receptacles that are adapted to mate with first and second MF connectors, respectively. The communications system comprises a single-harness optical subassembly that uses a plurality of the optical CSPs that interface with a switch IC chip of the communications system to perform electrical-to-optical and optical-to-electrical conversion.

Optical chip-scale package for use in a high channel density, high data rate data communications system having optical input/output (I/O) ports

A wavelength division multiplexing and demultiplexing (WDM) assembly is provided that is also capable of performing bidirectional communications. The WDM assembly comprises a WDM module and an adapter for use with the WDM module. The adapter has first and second receptacles in front and back ends thereof, respectively, that are configured to mate with a multi-fiber (MF) connector and with the WDM module, respectively. The MF connector holds ends of M optical fibers and the WDM module has M lenses. The WDM module holds ends of N optical fibers, where N is equal to or greater than 2M. When the MF connector and the WDM module are mated with the first and second receptacles, respectively, the ends of the M optical fibers held in the MF connector are in optical alignment with M lenses, respectively, disposed in the WDM module.

Multi-channel optical wavelength division multiplexing/demultiplexing (WDM) assembly and methods

A constructed photodetector, an optical receiver, and a receiver unit in an optical communication system are disclosed. One example of the disclosed constructed photodetector includes an optoelectronic element having an active area that converts light having a wavelength of interest into electrical signals and a substrate on a face that opposes the active area, where the substrate is non-transparent to light having the wavelength of interest. The constructed photodetector further includes a lens-chip that is at least partially transparent to light having the wavelength of interest, where the lens-chip includes a first side and an opposing second side, where the first side of the lens-chip includes an integrated lens, and where the second side of the lens-chip includes one or more electrical traces. The constructed photodetector further includes at least one connector that provides a physical and electrical connection between the optoelectronic element and the lens-chip.

Optical receiver using a photodetector with a self-aligned lens

A vertical cavity surface emitting laser (VCSEL) includes a substrate having an aperture that allows light generated in an active layer of the VCSEL to exit the VCSEL after propagation through a first set of semiconductor layers. The VCSEL further includes an opaque bottom layer that blocks light generated in the active layer and propagated through a second set of semiconductor layers. The opaque bottom layer can be attached to a heat sink for heat dissipation thereby allowing the VCSEL to be operated at high power levels. The active layer is sandwiched between the first set of semiconductor layers and the second set of semiconductor layers. Unlike a traditional VCSEL where only certain wavelengths of light can propagate through a solid substrate that is 'transparent' to these particular wavelengths, the aperture provided in the substrate of a VCSEL in accordance with the disclosure allows for propagation of many different wavelengths.

VCSEL incorporating a substrate having an aperture

An optical communications system and a pluggable optical communications module for use in the system are provided. The configuration of the pluggable optical communications module is such that no optical turn in any light path is required. Embodiments of the optical communications module include an EMI shielding solution and an electrical interface for electrically interfacing an electrical subassembly (ESA) of the module with a system printed circuit board (PCB) in a way that obviates the need for an optical turn.

Pluggable optical communications module and system with aligned ESA axis

A wafer-to-wafer bonded arrangement is provided comprising a VCSEL wafer and a highly thermally-conductive (HTC) wafer that are bonded together with the front side of the VCSEL wafer bonded to the HTC wafer. The VCSEL wafer is fabricated to include, at least initially, a native substrate. The HTC wafer includes a thermally-conductive, non-native substrate. All or a portion of the native substrate may be removed after performing wafer-to-wafer bonding. In effect, the HTC wafer becomes the substrate of the bonded pair. During operation of VCSEL dies diced from the bonded wafer, heat generated by the dies flows into the non-native substrate where the heat spreads out and is dissipated. Laser light generated by the VCSEL die is emitted through the back side of the VCSEL die.

Back-side-emitting vertical cavity surface emitting laser (VCSEL) wafer bonded to a heat-dissipation wafer, devices and methods

A known flip-chip assembly manufacturing process is augmented by process steps of the invention to create a VCSEL flip-chip assembly comprising a plurality of semiconductor devices having respective arrays of a small number of VCSELs thereon, which are mounted on a substrate to form a large array of VCSELs that are precisely optically aligned with their respective optical coupling elements.

Flip-chip assembly comprising an array of vertical cavity surface emitting lasers (VCSELs)

A connector assembly is provided that has optical communications capabilities and high data rate electrical communications capabilities and that is backwards compatible with one or more USB standards. A socket of the connector assembly has high data rate electrical connections and USB electrical connections such that it is capable of supporting high data rate signaling protocols for high data rate devices as well as USB signaling protocols. A plug of the connector assembly has high data rate electrical connections, USB electrical connections, and an optical-to-electrical (OE)/electrical-to-optical (EO) conversion module. The socket can be mated with the plug of the invention and with USB plugs that are compliant with existing USB plugs. Thus, both the socket and the plug have backwards compatibility with one or more existing USB standards.

Connector assembly that has optical and high data rate electrical capabilities and that is backwards compatible with earlier universal serial bus (USB) standards

A Mach-Zehnder modulator (MZM) is horizontally integrated with a VCSEL. The horizontally-integrated MZM overcomes wavelength dependence problems of horizontally-integrated EA modulators and yet has the same advantages as horizontally-integrated EA modulators in terms of overcoming the ER and modulation range problems associated with the vertically-integrated EA and EO modulators. By overcoming these problems with the existing integrated modulators, the operation speed of the VCSEL is increased and the modulation signal range is extended to allow a wider range of modulation signals and modulation schemes, including large-signal digital modulation schemes.

Integrated optoelectronic device comprising a Mach-Zehnder modulator and a vertical cavity surface emitting laser (VCSEL)

An optics system module for use in an optical communications module is provided that can be more easily aligned with the module during the mounting process, that reduces the possibility of the fiber ends being damaged when they are connected to the respective optical ports of the optics system, and that eliminates or reduces the occurrence of Fresnel losses at the interfaces between the fiber end faces and the optical ports. The optical ports have non-round shapes that are symmetrical to the shapes of the fibers in the transverse direction, i.e., in the direction that is transverse to the optical axes of the fibers. The non-round, symmetrical shape of the optical ports reduces the amount of force that the optical ports exert on the respective optical fibers.

Optics system module for use in an optical communications module, an optical communications system, and a method

A three-terminal VCSEL is provided that has a reduced fall time that allows the VCSEL to be operated at higher speeds. Methods of operating the three-terminal VCSEL are also provided. The VCSEL can be operated at higher speeds without decreasing the optical output of the VCSEL when its in the logical HIGH state.

Three-terminal vertical cavity surface emitting laser (VCSEL) and a method for operating a three-terminal VCSEL

An opto-electronic system includes a system substrate, a lens, a bridging device, and an opto-electronic chip mounted in a cavity in the system substrate. The bridging device, which can be another chip, a lens block, or an interposer, is mounted in flip-chip orientation to the opto-electronic chip and provides electrical interconnection with signal conductors of the system substrate.

Growing community of inventors

Fremont, CA, United States of America

Chung-Yi Su