Samsung Electro-mechanics Co., Ltd.

Chung-Woo Cho

Seok-Hwan Ahn

Soon-Jin Cho

Seung-Hyun Cho

Dong-Gyu Lee

Byung-Bae Seo

Ki-Young Yoo

Jin-Won Choi

A printed circuit board manufacturing system and a manufacturing method thereof are disclosed. A method of manufacturing printed circuit board, comprising: providing a substrate that comprises a pad and an insulation layer covering the pad; acquiring an image of the substrate; acquiring location information of the pad by analyzing the image of the substrate; forming a via hole by removing a part of the insulation layer that corresponds the location information of the pad; and forming a via by filling the via hole with a conductive material, provides improved process conformity, even if the substrate has partial or nonlinear deformation, by considering the location information of the pad in the via hole forming. The improved conformity may allow more flexibility to substrate design and more integrity for circuitries on printed circuit board.

Printed circuit board manufacturing system and manufacturing method thereof

A wafer packaging method is disclosed. An aspect of the invention is to provide a wafer packaging method comprising;

Wafer packaging method

Growing community of inventors

Suwon-si, South Korea

Chung-Woo Cho