Giga-Byte Technology Co., Ltd.

Chung-Wei Chiang

Yung-Shun Kao

Chih-Ming Lai

Tzu-Hsiang Huang

Hui-Ling Chung

Yu-Chiang Lu

A motherboard module is adapted for an M.2 expansion card to configure. The M.2 expansion card includes a connecting end and a fixing end. An edge of the fixing end has a semi-circular hole. The motherboard module includes a motherboard body, a locking member, and an abutting member. The motherboard body includes an expansion card slot, a first fixing hole, and a second fixing hole. The locking member is detachably fixed in the first fixing hole. The abutting member has a first end and a second end. The first end is detachably fixed in the second fixing hole. When the M.2 expansion card is installed on the motherboard module, the abutting member is located between the M.2 expansion card and the motherboard body, and the second end abuts against the M.2 expansion card. An electronic device is further provided.

Motherboard module and electronic device

A memory socket protecting cover adapted to be assembled to a memory socket which is adapted for a memory module to insert is provided. The memory module includes a fool-proof concave, and includes a fool-proof member corresponding to the fool-proof concave. The memory socket protecting cover includes two lateral walls and a wear-resistant member. The two lateral walls are adapted to be disposed at two sides of the memory socket. The wear-resistant member is connected to the two lateral walls and adapted to be disposed on the fool-proof member. A width of the wear-resistant member is greater than or equal to a width of the fool-proof member and is smaller than a width of the fool-proof concave. When the memory module is inserted in or pulled from the memory socket, a wall of the memory module besides the fool-proof concave is adapted to contact the wear-resistant member.

Memory socket protecting cover and memory socket assembly

An electronic device adapted for an expansion card is provided. The electronic device includes a main board and a light guide heat dissipation module. The main board includes a connector and a light source disposed beside the connector. The light guide heat dissipation module is detachably disposed on a position of the main board near the connector and is adapted to be thermally coupled to the expansion card inserted in the connector. The light guide heat dissipation module includes a first heat dissipation member, a second heat dissipation member thermally coupled to the first heat dissipation member, and a first light guide member disposed between the first heat dissipation member and the second heat dissipation member. The first heat dissipation member includes an opening, and the opening exposes a portion of the first light guide member. When the light guide heat dissipation module is disposed on the main board, light emitted by the light source is adapted to be guided by the first light guide member to the opening of the first heat dissipation member.

Electronic device

A connector module including a connector and a heatsink is provided. The connector includes a shaft. The heatsink includes a groove recessed in a single direction. The heatsink is adapted to move along a direction opposite to the recessed direction of the groove to insert the shaft into the groove. The shaft is pivoted in the groove so that the heatsink is adapted to pivotally rotate relative to the connector.

Connector module

A connector cover is adapted to cover a connector. A fixing member of the connector protrudes from a connector lateral and includes a base portion and a top board located on the base portion. The top board and the base portion form a T shape pillar. The connector cover includes four cover laterals, and one of the cover laterals includes a concave. A position of the concave located on the cover lateral corresponds to a position of the fixing member located on the connector lateral, and a width of the concave is close to a width of base portion. When the connector cover is assembled to the connector, the cover laterals lean against the connector laterals. The base portion is located in the concave and walls of the cover lateral besides the concave is near or lean against the base portion. A connector and a connector module are further provided.

Connector cover, connector and connector module

A connector cover adapted to cover a connector is provided. Two protrusions protruding from two ends of a connector body of the connector have two protrusion inner walls facing to each other and two grooves caved in the protrusion inner walls. The connector cover includes a cover body, having a cover top surface, and at least one cover protrusion disposed at a side of the cover body and protruding from the cover top surface. Each cover protrusion includes two cover protrusion side surfaces and at least one covering portion. Each covering portion, extending from one of the cover protrusion side surfaces and bending along outline of the protrusion protrusion inner wall to cover at least a portion of the protrusion protrusion inner wall, includes a protruding arm adapted to be located in the groove A cover module is further provided.

Connector cover and connector module

A PCI-E connector cover includes a first, a second cover lateral sides, a plurality of bending arms, a cover top surface and a plurality of connecting posts. The first, the second cover lateral sides and the cover top surface are adapted to cover a first, a second connector lateral sides and a connector top surface of a PCI-E connector. The bending arms are connected to the first cover lateral side and lean against a first connector concave of the PCI-E connector so as to keep an interval between the first cover lateral side and the first connector concave. The cover top surface is connected to the first, the second cover lateral sides. The connecting posts are extended from the first and the second cover lateral sides to fix to a main board. A PCI-E connector module is further provided.

PCI-E connector cover and PCI-E connector module

A circuit board is provided, comprising a substrate, a first conductive layer, at least one through hole, a protection layer, a plurality of contacts and a fixing element. The first conductive layer is formed on the substrate. The through hole is formed on the substrate and the first conductive layer. The protection layer is formed on the first conductive layer, wherein the protection layer comprises a plurality of hollow portions, the hollow portions surround the through hole, and the first conductive layer is exposed in the hollow portions. The contacts are disposed in the hollow portions, wherein the contacts are protruding from a surface of the protection layer. The fixing element is fixed in the through hole, wherein the fixing element contacts the contacts.

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Taipei, Taiwan

Chung-Wei Chiang